Quick answer: 2 Inch (50.8 mm) Fused Silica Wafers covers Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um); 50.8 mm format, TTV <5 um. Prototypes ship in 5-10 working days.
2 inch (50.8 mm) fused silica wafers are supplied as finished substrates: edge-rounded, cleaned and packed in wafer cassettes. The material brings near-zero thermal expansion and deep-UV transmission; the format brings SEMI-compatible handling.
Specification envelope
| Material | Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR)) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 50 mm |
| Maximum blank size | 450 x 450 mm |
| Diameter / format | 50.8 mm |
| Thickness | 0.2 – 1.0 mm typical |
| TTV | <5 um |
| Flat / notch | SEMI or C-flat |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Process window
Beyond this page, Fused Silica routinely runs through double-side polishing, grinding, dicing, cnc machining in our shop – most real parts combine two or three of these steps.
Getting the drawing right
Three items decide most of the cost and lead time on this work:
- Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
- Specify flat or notch orientation relative to your device layout – regrinding orientation later scraps the wafer.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Typical applications
The recurring buyers of 2 inch (50.8 mm) fused silica wafers: semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); aerospace optics (sensor windows, star-tracker flats, radiation-tolerant ports); ccd inspection equipment (CCD cover plates, reference grids, stage glass). Background reading on the underlying material science: RP Photonics: fused silica.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Engineers scoping this work usually also review material selection guide, fused silica wafer applications, high-purity quartz guide.
Common questions
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Fused Silica parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Its hardness and brittleness demand diamond tooling and controlled feeds.
What thickness range do you stock for Fused Silica?
Standard stock spans 0.10 – 50 mm, with blanks up to 450 x 450 mm. Other formats are sourced per order.
Specifications on this page were last reviewed by our engineering team in September 2026.