4 Inch (100 mm) Borofloat 33 Wafers – Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); 100 mm format, TTV <3 um. No minimum order; DFM review included with every RFQ.
A wafer is a specification bundle, not just a disc. 4 inch (100 mm) borofloat 33 wafers here mean SCHOTT float production, wafer grade material with certified CTE of 3.25 x 10^-6 /K, TTV controlled per format, and edges profiled for handler compatibility.
The numbers
| Material | Borofloat 33 (SCHOTT float production, wafer grade) |
|---|---|
| Thermal expansion (CTE) | 3.25 x 10^-6 /K |
| Service temperature | 450 C continuous |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.23 g/cm3 |
| Knoop hardness | 480 kg/mm2 |
| Refractive index | 1.471 @ 587 nm |
| Stock thickness | 0.70 – 25.4 mm |
| Maximum blank size | 500 x 500 mm |
| Diameter / format | 100 mm |
| Thickness | 0.5 or 0.7 mm standard |
| TTV | <3 um |
| Flat / notch | SEMI standard |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Getting the drawing right
Three items decide most of the cost and lead time on this work:
- Material note: float tin side must be tracked when parts see coating or bonding steps.
- Specify flat or notch orientation relative to your device layout – regrinding orientation later scraps the wafer.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Process window
Beyond this page, Borofloat 33 routinely runs through dicing, coring, ultrasonic machining, sandblasting in our shop – most real parts combine two or three of these steps.
Typical applications
Orders for 4 inch (100 mm) borofloat 33 wafers cluster in machine vision (camera windows, ring-light diffusers, calibration plates); optical sensors (sensor windows, filter caps, lens covers); mems devices (cap wafers, TGV substrates, motion-sensor lids). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
For adjacent specifications, see Borofloat 33 selection guide, wafer dicing process, optical polishing capability.
Common questions
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Borofloat 33 parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Float tin side must be tracked when parts see coating or bonding steps.
What thickness range do you stock for Borofloat 33?
Standard stock spans 0.70 – 25.4 mm, with blanks up to 500 x 500 mm. Other formats are sourced per order.
Specifications on this page were last reviewed by our engineering team in September 2026.