wafer

8 Inch (200 mm) Borofloat 33 Wafers

8 Inch (200 mm) Borofloat 33 Wafers: Borofloat 33, CTE 3.25 x 10^-6 /K. No MOQ, prototypes in 5-10 days, DFM review with every RFQ.

8 Inch (200 mm) Borofloat 33 Wafers

8 Inch (200 mm) Borofloat 33 Wafers: Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); 200 mm format, TTV <4 um. Single-piece prototypes to production volumes, quoted from your drawing.

8 inch (200 mm) borofloat 33 wafers are supplied as finished substrates: edge-rounded, cleaned and packed in wafer cassettes. The material brings float-glass flatness off the line and anodic bonding to silicon; the format brings SEMI-compatible handling.

Specifications at a glance

Material Borofloat 33 (SCHOTT float production, wafer grade)
Thermal expansion (CTE) 3.25 x 10^-6 /K
Service temperature 450 C continuous
Transmission range 350 nm – 2.0 um
Density 2.23 g/cm3
Knoop hardness 480 kg/mm2
Refractive index 1.471 @ 587 nm
Stock thickness 0.70 – 25.4 mm
Maximum blank size 500 x 500 mm
Diameter / format 200 mm
Thickness 0.7 – 1.1 mm
TTV <4 um
Flat / notch SEMI notch
RFQ inputs PDF/DXF/STEP drawing, quantity brackets, surface and edge spec

What the process holds

Beyond this page, Borofloat 33 routinely runs through lapping, drilling, ultrasonic machining, laser cutting in our shop – most real parts combine two or three of these steps.

DFM notes from the shop floor

The shop-floor rules that matter here:

  • Material note: float tin side must be tracked when parts see coating or bonding steps.
  • Specify flat or notch orientation relative to your device layout – regrinding orientation later scraps the wafer.
  • Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.

The full rules live in our tolerance design guide and holes and edges design guide.

Where these parts end up

Orders for 8 inch (200 mm) borofloat 33 wafers cluster in mems devices (cap wafers, TGV substrates, motion-sensor lids); microfluidic devices (chips, manifolds, via plates, bonded stacks); optical sensors (sensor windows, filter caps, lens covers). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.

The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.

Related reading on this site: Borofloat 33 selection guide, 4 inch Borofloat wafers, special-shaped glass plates.

Common questions

How fast can prototypes ship?

Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.

What files do you need for a quote?

A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.

Do parts ship with inspection data?

Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.

What tolerances are achievable on Borofloat 33 parts?

Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Float tin side must be tracked when parts see coating or bonding steps.

Specifications on this page were last reviewed by our engineering team in September 2026.

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