Borofloat 33 With Through Holes – Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); 0.15 – 100 mm diameter through plates to 40 mm. No minimum order; DFM review included with every RFQ.
Our borofloat 33 with through holes cover the full route from blank to inspected part: sawing, CNC profiling, drilling, grinding, polishing and edge finishing under one roof. Borofloat 33 stands out for float-glass flatness off the line and anodic bonding to silicon, and both properties survive our processing because every step is tuned to the material.
Specifications at a glance
| Material | Borofloat 33 (SCHOTT float production, wafer grade) |
|---|---|
| Thermal expansion (CTE) | 3.25 x 10^-6 /K |
| Service temperature | 450 C continuous |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.23 g/cm3 |
| Knoop hardness | 480 kg/mm2 |
| Refractive index | 1.471 @ 587 nm |
| Stock thickness | 0.70 – 25.4 mm |
| Maximum blank size | 500 x 500 mm |
| Feature | Through Holes |
| Capability | 0.15 – 100 mm diameter through plates to 40 mm |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Manufacturing capability
One material, many routes: on Borofloat 33 we also quote coring, etching, double-side polishing, polishing, and multi-step drawings are the norm rather than the exception.
These features are produced by drilling or coring. Capability: 0.15 – 100 mm diameter through plates to 40 mm. Design rule worth copying onto the drawing: exit-side chipping held under 0.1 mm with backing.
DFM notes from the shop floor
The shop-floor rules that matter here:
- Material note: float tin side must be tracked when parts see coating or bonding steps.
- Feature rule: exit-side chipping held under 0.1 mm with backing.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Where these parts end up
The recurring buyers of borofloat 33 with through holes: led packaging (groove covers, phosphor carriers, package windows); machine vision (camera windows, ring-light diffusers, calibration plates); mems devices (cap wafers, TGV substrates, motion-sensor lids). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Engineers scoping this work usually also review wafer dicing process, Borofloat 33 selection guide, ITO coated glass.
Common questions
Is there a minimum order for borofloat 33 with through holes?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
Specifications on this page were last reviewed by our engineering team in September 2026.