Quick answer: Dicing Borosilicate Glass covers Borosilicate Glass (CTE 3.3 x 10^-6 /K, 360 nm – 2.0 um); Dicing to +/-0.01 mm index accuracy. Prototypes ship in 5-10 working days.
Ask any process engineer what makes borosilicate glass difficult and the answer is specific: sheet stock carries more thickness variation than float wafer stock, so lapping is often the first step. Our dicing line is tooled around exactly that – automatic dicing saws with resin and metal-bond blades – holding +/-0.01 mm index accuracy on parts from 0.05 – 3 mm thick.
Specification envelope
| Material | Borosilicate Glass (3.3 expansion group per ISO 3585) |
|---|---|
| Thermal expansion (CTE) | 3.3 x 10^-6 /K |
| Service temperature | 450 C continuous |
| Transmission range | 360 nm – 2.0 um |
| Density | 2.23 g/cm3 |
| Knoop hardness | 480 kg/mm2 |
| Refractive index | 1.473 @ 587 nm |
| Stock thickness | 0.50 – 30 mm |
| Maximum blank size | 600 x 400 mm |
| Process | Dicing |
| Working tolerance | +/-0.01 mm index accuracy |
| Minimum feature | 30 um kerf |
| Surface finish | edge chipping under 15 um |
| Thickness window | 0.05 – 3 mm |
| Edge condition | saw edge, optional etch relief |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Manufacturing capability
The core strength of Dicing is singulating wafers into dies with tight index accuracy and low chipping. The honest limit: straight-line cuts only; contours route to laser cutting instead. Both belong on the drawing before quoting, not after.
One material, many routes: on Borosilicate Glass we also quote double-side polishing, cnc machining, coring, drilling, and multi-step drawings are the norm rather than the exception.
Getting the drawing right
Before sending the RFQ, check these against your drawing:
- Material note: sheet stock carries more thickness variation than float wafer stock, so lapping is often the first step.
- Process boundary: straight-line cuts only; contours route to laser cutting instead.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Typical applications
dicing borosilicate glass shows up across medical diagnostics (flow cells, slides, microplate bottoms, cuvette windows); scientific instruments (reference flats, cells, prism mounts, stage inserts); laboratory instruments (cuvettes, sight glasses, stir-cell windows). Background reading on the underlying material science: ISO 3585 borosilicate glass 3.3.
Dimensions still moving? Configure this part live in the 3D builder below, or open the full custom glass machining 3D builder to start from a blank canvas.
Useful companion pages: material selection guide, wafer dicing process, FTO conductive glass.
Buyer questions, answered
What tolerances are achievable on Borosilicate Glass parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Sheet stock carries more thickness variation than float wafer stock, so lapping is often the first step.
What thickness range do you stock for Borosilicate Glass?
Standard stock spans 0.50 – 30 mm, with blanks up to 600 x 400 mm. Other formats are sourced per order.
How does Borosilicate Glass behave under heat?
CTE is 3.3 x 10^-6 /K and continuous service reaches 450 C continuous, which is what drives its use where chemical durability matters.
What accuracy does dicing hold?
+/-0.01 mm index accuracy with minimum features of 30 um kerf. Straight-line cuts only; contours route to laser cutting instead.
What equipment runs the dicing work?
Automatic dicing saws with resin and metal-bond blades.
Specifications on this page were last reviewed by our engineering team in July 2026.