Dicing JGS2 Quartz Glass – JGS2 Quartz Glass (CTE 0.55 x 10^-6 /K, 220 nm – 2.5 um); Dicing to +/-0.01 mm index accuracy. No minimum order; DFM review included with every RFQ.
dicing jgs2 quartz glass is a materials problem before it is a machining problem. JGS2 Quartz Glass has visible and near-ir clarity and a Knoop hardness of 500 kg/mm2, so the dicing recipe – feeds, coolant, tooling – differs from what works on ordinary float glass. The line runs automatic dicing saws with resin and metal-bond blades and holds +/-0.01 mm index accuracy.
Key parameters
| Material | JGS2 Quartz Glass (Optical grade, bubble class 1) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 220 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.20 – 40 mm |
| Maximum blank size | 300 mm diameter |
| Process | Dicing |
| Working tolerance | +/-0.01 mm index accuracy |
| Minimum feature | 30 um kerf |
| Surface finish | edge chipping under 15 um |
| Thickness window | 0.05 – 3 mm |
| Edge condition | saw edge, optional etch relief |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Specification advice
Three items decide most of the cost and lead time on this work:
- Material note: thicker blanks need stress-relief annealing before tight-flatness grinding.
- Process boundary: straight-line cuts only; contours route to laser cutting instead.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Capabilities and limits
The core strength of Dicing is singulating wafers into dies with tight index accuracy and low chipping. The honest limit: straight-line cuts only; contours route to laser cutting instead. Both belong on the drawing before quoting, not after.
One material, many routes: on JGS2 Quartz Glass we also quote sandblasting, cnc machining, drilling, grinding, and multi-step drawings are the norm rather than the exception.
Where these parts end up
dicing jgs2 quartz glass shows up across laboratory instruments (cuvettes, sight glasses, stir-cell windows); aerospace optics (sensor windows, star-tracker flats, radiation-tolerant ports); oled packaging (cover lids, frit-seal frames, fill-port plates). Background reading on the underlying material science: ScienceDirect: fused quartz.
Dimensions still moving? Configure this part live in the 3D builder below, or open the full custom glass machining 3D builder to start from a blank canvas.
Useful companion pages: fused silica wafers 2-12 inch, wafer dicing process, 4 inch Borofloat wafers.
Buyer questions, answered
What tolerances are achievable on JGS2 Quartz Glass parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Thicker blanks need stress-relief annealing before tight-flatness grinding.
What thickness range do you stock for JGS2 Quartz Glass?
Standard stock spans 0.20 – 40 mm, with blanks up to 300 mm diameter. Other formats are sourced per order.
How does JGS2 Quartz Glass behave under heat?
CTE is 0.55 x 10^-6 /K and continuous service reaches 1,100 C continuous, which is what drives its use where visible and near-IR clarity matters.
What accuracy does dicing hold?
+/-0.01 mm index accuracy with minimum features of 30 um kerf. Straight-line cuts only; contours route to laser cutting instead.
Specifications on this page were last reviewed by our engineering team in July 2026.