Drilling Quartz Glass – Quartz Glass (CTE 0.59 x 10^-6 /K, 260 nm – 2.5 um); Drilling to +/-0.02 mm hole position. No minimum order; DFM review included with every RFQ.
Ask any process engineer what makes quartz glass difficult and the answer is specific: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt. Our drilling line is tooled around exactly that – diamond core drills, ultrasonic assist and laser percussion heads – holding +/-0.02 mm hole position on parts from 0.1 – 30 mm thick.
Specification envelope
| Material | Quartz Glass (GE214-equivalent, semiconductor grade) |
|---|---|
| Thermal expansion (CTE) | 0.59 x 10^-6 /K |
| Service temperature | 1,050 C continuous |
| Transmission range | 260 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.459 @ 587 nm |
| Stock thickness | 0.20 – 60 mm |
| Maximum blank size | 450 mm diameter |
| Process | Drilling |
| Working tolerance | +/-0.02 mm hole position |
| Minimum feature | 0.15 mm laser / 0.5 mm mechanical |
| Surface finish | exit-chip controlled below 0.1 mm |
| Thickness window | 0.1 – 30 mm |
| Edge condition | optional chamfered hole entry |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Manufacturing capability
The core strength of Drilling is through-holes, blind holes and countersinks at densities beyond 1,000 holes per part. The honest limit: hole-to-edge distance should stay above 1.5x thickness to protect strength. Both belong on the drawing before quoting, not after.
One material, many routes: on Quartz Glass we also quote laser cutting, edge grinding, etching, dicing, and multi-step drawings are the norm rather than the exception.
Getting the drawing right
Three items decide most of the cost and lead time on this work:
- Material note: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
- Process boundary: hole-to-edge distance should stay above 1.5x thickness to protect strength.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Who orders this
The recurring buyers of drilling quartz glass: semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); laboratory instruments (cuvettes, sight glasses, stir-cell windows). Background reading on the underlying material science: ScienceDirect: quartz glass.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
For adjacent specifications, see high-purity quartz guide, ultra-thin quartz discs, AR optical windows.
Buyer questions, answered
What equipment runs the drilling work?
Diamond core drills, ultrasonic assist and laser percussion heads.
Is there a minimum order for drilling quartz glass?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Specifications on this page were last reviewed by our engineering team in September 2026.