Fused Silica for Semiconductor Equipment: Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um). Single-piece prototypes to production volumes, quoted from your drawing.
What fused silica for semiconductor equipment actually buys from a glass shop: view ports, wafer carriers, plasma rings, chamber windows. The requirement underneath is plasma-resistant, particle-clean quartz and fused silica hardware. Fused Silica is the fit here because it offers near-zero thermal expansion.
Key parameters
| Material | Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR)) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 50 mm |
| Maximum blank size | 450 x 450 mm |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Getting the drawing right
Before sending the RFQ, check these against your drawing:
- Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
What the process holds
Beyond this page, Fused Silica routinely runs through coring, sandblasting, ultrasonic machining, edge grinding in our shop – most real parts combine two or three of these steps.
Application context
Orders for fused silica for semiconductor equipment cluster in ccd inspection equipment (CCD cover plates, reference grids, stage glass); aerospace optics (sensor windows, star-tracker flats, radiation-tolerant ports); laboratory instruments (cuvettes, sight glasses, stir-cell windows). Background reading on the underlying material science: RP Photonics: fused silica.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Engineers scoping this work usually also review wafer dicing process, material selection guide, JGS1 quartz glass.
Common questions
Is there a minimum order for fused silica for semiconductor equipment?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Fused Silica parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Its hardness and brittleness demand diamond tooling and controlled feeds.
Specifications on this page were last reviewed by our engineering team in September 2026.