Fused Silica With Blind Holes – Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um); depth control +/-0.05 mm, flat or radiused bottom. No minimum order; DFM review included with every RFQ.
Buyers come to fused silica with blind holes with two kinds of parts: catalog-adjacent blanks that need accurate finishing, and genuinely custom geometry. We quote both from the same dataset – JGS1 (UV), JGS2 (standard), JGS3 (IR) stock in 0.10 – 50 mm, blanks to 450 x 450 mm.
The numbers
| Material | Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR)) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 50 mm |
| Maximum blank size | 450 x 450 mm |
| Feature | Blind Holes |
| Capability | depth control +/-0.05 mm, flat or radiused bottom |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Design guidance
Before sending the RFQ, check these against your drawing:
- Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
- Feature rule: leave at least 30% of thickness under the bottom.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
What the process holds
Beyond this page, Fused Silica routinely runs through ultrasonic machining, coring, drilling, double-side polishing in our shop – most real parts combine two or three of these steps.
These features are produced by ultrasonic machining or cnc machining. Capability: depth control +/-0.05 mm, flat or radiused bottom. Design rule worth copying onto the drawing: leave at least 30% of thickness under the bottom.
Who orders this
Orders for fused silica with blind holes cluster in ccd inspection equipment (CCD cover plates, reference grids, stage glass); mems devices (cap wafers, TGV substrates, motion-sensor lids); laser systems (windows, beam splitters, debris shields). Background reading on the underlying material science: RP Photonics: fused silica.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
Useful companion pages: CNC machining capability, fused silica wafers 2-12 inch, FTO conductive glass.
Buyer questions, answered
Is there a minimum order for fused silica with blind holes?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
Specifications on this page were last reviewed by our engineering team in September 2026.