Fused Silica With Through Holes: Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um); 0.15 – 100 mm diameter through plates to 40 mm. Single-piece prototypes to production volumes, quoted from your drawing.
When a drawing calls out Fused Silica, three numbers matter before any machining starts: CTE of 0.55 x 10^-6 /K, service temperature to 1,100 C continuous, and a transmission window of 185 nm – 2.5 um. fused silica with through holes here begin with those numbers and end with dimensional reports.
Specifications at a glance
| Material | Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR)) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 50 mm |
| Maximum blank size | 450 x 450 mm |
| Feature | Through Holes |
| Capability | 0.15 – 100 mm diameter through plates to 40 mm |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Manufacturing capability
One material, many routes: on Fused Silica we also quote cnc machining, dicing, grinding, double-side polishing, and multi-step drawings are the norm rather than the exception.
These features are produced by drilling or coring. Capability: 0.15 – 100 mm diameter through plates to 40 mm. Design rule worth copying onto the drawing: exit-side chipping held under 0.1 mm with backing.
Design guidance
The shop-floor rules that matter here:
- Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
- Feature rule: exit-side chipping held under 0.1 mm with backing.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Typical applications
Orders for fused silica with through holes cluster in semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); microfluidic devices (chips, manifolds, via plates, bonded stacks); laser systems (windows, beam splitters, debris shields). Background reading on the underlying material science: RP Photonics: fused silica.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
Useful companion pages: fused silica wafer applications, material selection guide, custom microfluidic chip.
Buyer questions, answered
How does Fused Silica behave under heat?
CTE is 0.55 x 10^-6 /K and continuous service reaches 1,100 C continuous, which is what drives its use where near-zero thermal expansion matters.
What is the design rule for through holes?
Exit-side chipping held under 0.1 mm with backing.
Is there a minimum order for fused silica with through holes?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Specifications on this page were last reviewed by our engineering team in August 2026.