Process Capability

Grinding Borofloat 33

Grinding Borofloat 33: Borofloat 33, CTE 3.25 x 10^-6 /K; flatness to 5 um over 100 mm. No MOQ, prototypes in 5-10 days, DFM review with every RFQ.

Grinding Borofloat 33

Grinding Borofloat 33 – Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); Grinding to flatness to 5 um over 100 mm. No minimum order; DFM review included with every RFQ.

Ask any process engineer what makes borofloat 33 difficult and the answer is specific: float tin side must be tracked when parts see coating or bonding steps. Our grinding line is tooled around exactly that – rotary surface grinders and double-disc machines with diamond wheels – holding flatness to 5 um over 100 mm on parts from 0.3 – 60 mm thick.

Specification envelope

Material Borofloat 33 (SCHOTT float production, wafer grade)
Thermal expansion (CTE) 3.25 x 10^-6 /K
Service temperature 450 C continuous
Transmission range 350 nm – 2.0 um
Density 2.23 g/cm3
Knoop hardness 480 kg/mm2
Refractive index 1.471 @ 587 nm
Stock thickness 0.70 – 25.4 mm
Maximum blank size 500 x 500 mm
Process Grinding
Working tolerance flatness to 5 um over 100 mm
Minimum feature thickness to +/-0.005 mm
Surface finish Ra 0.2 – 0.8 um
Thickness window 0.3 – 60 mm
Edge condition ground perimeter, squareness 0.02 mm
RFQ inputs PDF/DXF/STEP drawing, quantity brackets, surface and edge spec

Manufacturing capability

The core strength of Grinding is bringing thickness, flatness and parallelism into calibrated tolerance before polish. The honest limit: subsurface damage of 5 – 15 um must be budgeted and removed by polishing on optical faces. Both belong on the drawing before quoting, not after.

One material, many routes: on Borofloat 33 we also quote laser cutting, cnc machining, sandblasting, lapping, and multi-step drawings are the norm rather than the exception.

Design guidance

The shop-floor rules that matter here:

  • Material note: float tin side must be tracked when parts see coating or bonding steps.
  • Process boundary: subsurface damage of 5 – 15 um must be budgeted and removed by polishing on optical faces.
  • Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.

The full rules live in our tolerance design guide and holes and edges design guide.

Who orders this

The recurring buyers of grinding borofloat 33: optical sensors (sensor windows, filter caps, lens covers); machine vision (camera windows, ring-light diffusers, calibration plates); led packaging (groove covers, phosphor carriers, package windows). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.

The fastest route to a quote is geometry: use the 3D configurator below, or the site-wide custom glass machining 3D builder for fully custom parts.

Engineers scoping this work usually also review Borofloat 33 selection guide, edge grinding overview, fused silica wafers 2-12 inch.

Buyer questions, answered

What tolerances are achievable on Borofloat 33 parts?

Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Float tin side must be tracked when parts see coating or bonding steps.

What thickness range do you stock for Borofloat 33?

Standard stock spans 0.70 – 25.4 mm, with blanks up to 500 x 500 mm. Other formats are sourced per order.

How does Borofloat 33 behave under heat?

CTE is 3.25 x 10^-6 /K and continuous service reaches 450 C continuous, which is what drives its use where float-glass flatness off the line matters.

What accuracy does grinding hold?

Flatness to 5 um over 100 mm with minimum features of thickness to +/-0.005 mm. Subsurface damage of 5 – 15 um must be budgeted and removed by polishing on optical faces.

Specifications on this page were last reviewed by our engineering team in July 2026.

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Engineering Review

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