Laser Cutting Quartz Glass Wafers – Quartz Glass (CTE 0.59 x 10^-6 /K, 260 nm – 2.5 um); Laser Cutting to +/-0.02 mm contour. No minimum order; DFM review included with every RFQ.
The combination of Quartz Glass and Laser Cutting comes up constantly in RFQs for a reason – the material offers plasma and halogen resistance, and Laser Cutting is the right way to get accurate geometry into it. Expect +/-0.02 mm contour and sealed edge, chip-free.
The numbers
| Material | Quartz Glass (GE214-equivalent, semiconductor grade) |
|---|---|
| Thermal expansion (CTE) | 0.59 x 10^-6 /K |
| Service temperature | 1,050 C continuous |
| Transmission range | 260 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.459 @ 587 nm |
| Stock thickness | 0.20 – 60 mm |
| Maximum blank size | 450 mm diameter |
| Process | Laser Cutting |
| Working tolerance | +/-0.02 mm contour |
| Minimum feature | 0.10 mm hole diameter |
| Surface finish | sealed edge, chip-free |
| Thickness window | 0.03 – 6 mm |
| Edge condition | filamentation edge, optional post-polish |
| Wafer formats | 2", 3", 4", 6", 8" and 12" with SEMI flats or notch |
| TTV | under 3 – 5 um by format |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
DFM notes from the shop floor
Before sending the RFQ, check these against your drawing:
- Material note: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
- Process boundary: aspect ratio in a single pass tops out near 10:1; thicker sections shift to coring or ultrasonic work.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
What the process holds
Laser Cutting earns its place through chip-free free-form contours and dense hole arrays in thin and ultra-thin glass. Its boundary condition – aspect ratio in a single pass tops out near 10:1; thicker sections shift to coring or ultrasonic work – is the first thing our DFM review checks.
Beyond this page, Quartz Glass routinely runs through cnc machining, etching, coring, lapping in our shop – most real parts combine two or three of these steps.
Where these parts end up
The recurring buyers of laser cutting quartz glass wafers: semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); laboratory instruments (cuvettes, sight glasses, stir-cell windows). Background reading on the underlying material science: ScienceDirect: quartz glass.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Engineers scoping this work usually also review beam splitter glass, JGS1 quartz glass, glass hole micromachining.
Common questions
What equipment runs the laser cutting work?
Picosecond and CO2 laser stations with vision registration.
Is there a minimum order for laser cutting quartz glass wafers?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Specifications on this page were last reviewed by our engineering team in September 2026.