Ultrasonic Machining Quartz Glass – Quartz Glass (CTE 0.59 x 10^-6 /K, 260 nm – 2.5 um); Ultrasonic Machining to +/-0.02 mm form. No minimum order; DFM review included with every RFQ.
Ask any process engineer what makes quartz glass difficult and the answer is specific: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt. Our ultrasonic machining line is tooled around exactly that – 20 kHz ultrasonic spindles with shaped diamond form tools – holding +/-0.02 mm form on parts from 0.5 – 25 mm thick.
Specification envelope
| Material | Quartz Glass (GE214-equivalent, semiconductor grade) |
|---|---|
| Thermal expansion (CTE) | 0.59 x 10^-6 /K |
| Service temperature | 1,050 C continuous |
| Transmission range | 260 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.459 @ 587 nm |
| Stock thickness | 0.20 – 60 mm |
| Maximum blank size | 450 mm diameter |
| Process | Ultrasonic Machining |
| Working tolerance | +/-0.02 mm form |
| Minimum feature | 0.3 mm blind features |
| Surface finish | matte machined surface |
| Thickness window | 0.5 – 25 mm |
| Edge condition | crack-free feature edges |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Process window
Ultrasonic Machining earns its place through blind cavities, non-round holes and stepped profiles that rotary tools cannot reach. Its boundary condition – material removal is slow, so it is reserved for features other processes cannot form – is the first thing our DFM review checks.
Beyond this page, Quartz Glass routinely runs through double-side polishing, drilling, laser cutting, lapping in our shop – most real parts combine two or three of these steps.
Design guidance
The shop-floor rules that matter here:
- Material note: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
- Process boundary: material removal is slow, so it is reserved for features other processes cannot form.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Who orders this
Orders for ultrasonic machining quartz glass cluster in semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); laboratory instruments (cuvettes, sight glasses, stir-cell windows). Background reading on the underlying material science: ScienceDirect: quartz glass.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Related reading on this site: high-purity quartz guide, ultra-thin quartz discs, AR coated glass materials.
Common questions
What equipment runs the ultrasonic machining work?
20 kHz ultrasonic spindles with shaped diamond form tools.
Is there a minimum order for ultrasonic machining quartz glass?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Specifications on this page were last reviewed by our engineering team in September 2026.