SKU MG-9B82D3

Advanced Precise White Machinable Macor Glass Ceramic Plate Wafer

Advanced Precise White Machinable Macor Glass Ceramic Plate Wafer — a glass wafer. Specs, RFQ checklist and custom sizes to drawing.

Ceramic PlatesType
CustomizedSize
Electronics, Structure CeramicApplication
BBXMA001Model NO.
Advanced Precise White Machinable Macor Glass Ceramic Plate Wafer

Product type: Ceramic Plates. Application: Electronics, Structure Ceramic. Model: BBXMA001.

Overview

Advanced Precise White Machinable Macor Glass Ceramic Plate Wafer is a glass wafer. Listed geometry: size Customized. Temperature 800 Degree. It is used in Electronics and Structure Ceramic. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.

Specifications

Type Ceramic Plates
Size Customized
Application Electronics, Structure Ceramic
Model NO. BBXMA001
Color White
Surface Smooth
Property Machinable
Density 2.6g/cm3
Apparent Porosity 0.069%
Hardness 4~5 Mohs
Coefficient of Thermal Expansion 72*10-7/C
Long Working Temperature 800 Degree
Flexural Strength >108MPa
Compression Strength >508 MPa
Impact Toughness >2.56kj/ M2
Keyword Macor Wafer
ISO 9001 2015 and IATF 16949
ISO9001 2015 Quality Management System
Period of validity from2024.10.17 to 2027.10.25
Date MAY .08.2026
Supplier Lianyungang Highborn Technology Co., Ltd.

Technical data

Property Content Property Index Instruction
Density 2.6g/cm3
Apparent Porosity 0.069%
Water Absorption 0
Hardness 4~5 Mohs
Color White
Coefficient of Thermal Expansion 72×10-7/°C -50°C to 200°C average
Thermal Conductivity 1.71W/m.k 25°C
Long Working Temperature 800°C
Flexural Strength >108MPa
Compression Strength >508MPa
Impact Toughness >2.56KJ/ m2
Modulus of Elasticity 65GPa Room Temperature
Dielectric Loss 1~4×10-3
Dielectric Constant 6~7 “
Puncture Strength >40KV/mm Sample Thickness 1mm
Volume Resistance 1.08×1016Ω.cm 25°C
1.5×1012Ω.cm 200°C
1.1×109Ω.cm 500°C
Normal Temperature Gas Efficiency 8.8×10-9ml/s.cm2 Vacuum Burn-in 8 hours
Helium Through Rate 1×10-10ml/s 500°C firing, cooling
5%HC1 0.26mg/ cm2 95°C,24hours
5%HF 83mg/ cm2 “
50%Na2CO3 0.012 mg/ cm2 “
5%NaOH 0.85mg/ cm2 “

What to specify when you request a quote

  • Diameter and flat / notch — listed as “Customized”; state diameter, flat or notch and their tolerances.
  • Thickness and TTV — give thickness, its tolerance and total thickness variation.
  • Polish and roughness — listed as “Smooth”; specify single- or double-side polish and roughness.
  • Flatness, bow and warp — quote flatness, bow and warp limits.
  • Material grade — name the grade (JGS1/JGS2, Borofloat 33, alkali-free, sapphire orientation).

Engineering guides for this part

For material grades and coating options, see BOROFLOAT 33 & Alkali-Free Glass Wafers: Material Guide. How parts like this are machined and finished is covered in Precision Glass Hole Machining for MEMS and Wafer Parts. For an application example, read Alkali-Free Glass Wafers for Appliance Display Substrates. Before sending a drawing, check Precision Glass Machining Tolerances & Specifications: A B2B Guide. A related standard product is Alkali-Free Glass Wafers.

FAQ

What sizes and thicknesses are available? expand_more
The listing gives size Customized. Custom outlines and thicknesses are made to drawing; state the tolerance you need.
Where is this glass wafer used? expand_more
Listed applications: Electronics and Structure Ceramic.
What should I include in a quote request? expand_more
Include diameter and flat / notch, thickness and ttv, polish and roughness, flatness, bow and warp and material grade, plus quantity and a drawing if the part is custom.
Configure in 3D, draw in 2D

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3D Precision Glass Configurator Build a visual 3D preview for custom precision glass parts, including wafers, microfluidic chips, coated glass, optical filters, and machined quartz plates. This tool is for visual configuration only. Final dimensions, tolerances, materials, coatings, and manufacturability will be reviewed from your drawing or specification.
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FREQUENTLY ASKED QUESTIONS
Which fused silica grade should I choose — JGS1, JGS2 or JGS3?

JGS1 offers deep-UV transmission from about 185 nm (best for DUV lithography and UV laser optics). JGS2 transmits well from about 220 nm for standard UV-visible use at lower cost. JGS3 is optimized for visible-to-infrared and high-power laser work. The builder exposes a transmission-band requirement so you can specify the grade by application.

What wafer diameters and thicknesses are supported?

Common diameters are 2, 3, 4 and 6 inch (note 1 inch = 25.0 mm for quartz wafers, so a 4 inch wafer is 100 mm). Typical thicknesses are 200, 500, 700 and 1000 µm, with tighter thickness tolerance and TTV specifiable for polished optical grades.

Can I specify TTV, surface quality and a flat or notch?

Yes. You can set total thickness variation, scratch-dig surface quality (down to 40/20 or 20/10 for optical grade), single- or double-side polish, and a primary flat or notch for orientation.

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Advanced Precise White Machinable Macor Glass Ceramic Plate Wafer

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