SKU MG-WF-04

Fused Quartz Wafer

High-temperature quartz wafers for furnace, optical and semiconductor use.

Fused quartzMaterial
1000 °CMax temp
2–8 inchDiameter
≥ 99.99% SiO₂Purity
Fused Quartz Wafer

High-temperature quartz wafers for furnace, optical and semiconductor use. Every glass & quartz wafers part is made to your drawing, so dimensions, material grade, coatings and finish are all specified by you and verified in-house before shipping.

Overview

Fused Quartz Wafer is produced from Fused silica, quartz and borosilicate wafers from 2 to 12 inches, diced, ground and cleaned for semiconductor and photonics processing. We machine, finish and inspect the part under one roof, which keeps tolerances, surface quality and documentation consistent from prototype through to production quantities.

Typical applications

Customers use this component across photonics, semiconductor, biomedical and instrumentation work. Whether it goes into an optical path, a sensor stack, a diagnostic device or a piece of process tooling, the geometry and surface specification can be tuned to your exact requirement.

How we make it

Depending on the design we combine femtosecond laser ablation, CNC ultrasonic machining, precision dicing, optical polishing, thin-film coating and thermal or anodic bonding. A design-for-manufacturing review checks feasibility before cutting, so problems are caught on the drawing rather than on the shop floor.

Specifications

Material Fused quartz
Max temp 1000 °C
Diameter 2–8 inch
Purity ≥ 99.99% SiO₂

Request a quote

Send a STEP, DXF or PDF drawing with your tolerances, material and quantity and we will respond with feasibility and lead time. You can also configure this part in the 3D Glass Builder and submit the specification directly.

Configure in 3D

3D Builder

PRECISION GLASS 3D
3D Precision Glass Configurator Build a visual 3D preview for custom precision glass parts, including wafers, microfluidic chips, coated glass, optical filters, and machined quartz plates. This tool is for visual configuration only. Final dimensions, tolerances, materials, coatings, and manufacturability will be reviewed from your drawing or specification.
3D GLASS PREVIEW Visual Specification

Glass Wafer Builder

Interactive visual preview for custom precision glass configuration.

SP SPEC SUMMARY:

SUBMIT RFQ — ENGINEERING REVIEW Your current 3D configuration and specification summary are attached automatically. Attach a drawing if you have one.
Arithmetic verification image

FREQUENTLY ASKED QUESTIONS
Which fused silica grade should I choose — JGS1, JGS2 or JGS3?

JGS1 offers deep-UV transmission from about 185 nm (best for DUV lithography and UV laser optics). JGS2 transmits well from about 220 nm for standard UV-visible use at lower cost. JGS3 is optimized for visible-to-infrared and high-power laser work. The builder exposes a transmission-band requirement so you can specify the grade by application.

What wafer diameters and thicknesses are supported?

Common diameters are 2, 3, 4 and 6 inch (note 1 inch = 25.0 mm for quartz wafers, so a 4 inch wafer is 100 mm). Typical thicknesses are 200, 500, 700 and 1000 µm, with tighter thickness tolerance and TTV specifiable for polished optical grades.

Can I specify TTV, surface quality and a flat or notch?

Yes. You can set total thickness variation, scratch-dig surface quality (down to 40/20 or 20/10 for optical grade), single- or double-side polish, and a primary flat or notch for orientation.

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Engineering Review

Ready to quote this part?

Send drawings and target performance data so engineering can review geometry, material and lead time.