SKU MG-0AB1AB

Super Thin Borosilicate Glass Wafer for CMOS Imaging Sensor

Super Thin Borosilicate Glass Wafer for CMOS Imaging Sensor — a CCD / CMOS sensor cover glass: Element Semiconductor. Specs, RFQ checklist and custom…

Element SemiconductorMaterial
Intrinsic SemiconductorType
0.01mmParallelism
Solar CellApplication
Super Thin Borosilicate Glass Wafer for CMOS Imaging Sensor

Product type: Intrinsic Semiconductor. Application: Solar Cell. Model: TK046.

Overview

Super Thin Borosilicate Glass Wafer for CMOS Imaging Sensor: a CCD / CMOS sensor cover glass made from Element Semiconductor. Temperature 550degree C. Listed for Solar Cell applications. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.

Specifications

Material Element Semiconductor
Type Intrinsic Semiconductor
Parallelism 0.01mm
Application Solar Cell
Thickness 1 0.1mm 0.2mm 0.3mm 0.4mm
Thickess 2 0.5mm 0.7mm 1.1mm
Temperature 550degree C
Model NO. TK046
Surface Clearning 60/40
Surface Roughness 1nm
Manufacturing Technology Optoelectronic Semiconductor
Signal Processing Analog Digital Composite and Function
Model ST
Batch Number 2010+
l Typical application Micro-optics
a) Material BOROFLOAT®33, PYREX7740, quartz glass, Corning Eagle-XG, B270, D262T, AF32,Soda lime
b) Standard thickness 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.7mm, 1.0mm, 1.5mm (thickness tolerance ± 0.02mm)
c) Standard size Φ2", Φ3", Φ4", Φ5", Φ6", Φ8", Φ12" (other sizes can be customized)
d) Appearance 60/40
Supplier Xinyu Xu Tking Glass Co., Ltd.

What to specify when you request a quote

  • Material and grade — listed as “Element Semiconductor”; name the glass or crystal grade (for example JGS1, N-BK7, Borofloat 33, sapphire) because it fixes the transmission band and thermal limits.
  • Diameter or outline — listed as “Φ2", Φ3", Φ4", Φ5", Φ6", Φ8", Φ12" (other sizes can be customized)”; give the nominal size and the tolerance you can accept.
  • Thickness — listed as “0.1mm 0.2mm 0.3mm 0.4mm”; state nominal thickness and tolerance; thinner windows need tighter flatness control.
  • Surface quality and flatness — listed as “0.01mm”; quote scratch-dig and flatness over the clear aperture, not the whole part.
  • Coating — list the wavelength band and the maximum reflectance per surface for any AR coating.
  • Clear aperture and edges — define the usable aperture and the edge chamfer.

Engineering guides for this part

For material grades and coating options, see Infrared Window Glass: Material Options for Optical Sensors & Parts. How parts like this are machined and finished is covered in Precision Glass Hole Drilling & Micromachining for MEMS Wafers. For an application example, read Bulk Ordering Glass Windows for Robotic Vacuum Optical Sensors. Before sending a drawing, check Specifying Coatings for Custom Glass Windows and Substrates. A related standard product is Infrared Windows.

FAQ

What is the Super Thin Borosilicate Glass Wafer for CMOS Imaging Sensor made of? expand_more
It is listed as Element Semiconductor. Other grades can be quoted if your application needs different transmission, thermal or chemical properties.
Where is this CCD / CMOS sensor cover glass used? expand_more
Listed applications: Solar Cell.
What should I include in a quote request? expand_more
Include material and grade, diameter or outline, thickness, surface quality and flatness and coating, plus quantity and a drawing if the part is custom.
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FREQUENTLY ASKED QUESTIONS
What makes a CCD/CMOS cover plate different from a standard window?

These are thin, double-side-polished optical plates emphasizing cleanliness and low particle count for imaging stages. You can specify polish type, AR coating band, scratch-dig and cleanroom packing.

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Super Thin Borosilicate Glass Wafer for CMOS Imaging Sensor

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