SKU MG-0F5EC5

Ultrasonic Drilling B270 Glass Glass Substrate Af45 Af32

Ultrasonic Drilling B270 Glass Glass Substrate Af45 Af32 — a drilled / perforated glass plate: Element Semiconductor. Specs, RFQ checklist and custom…

Element SemiconductorMaterial
Intrinsic SemiconductorType
0.01mmParallelism
Solar CellApplication
Ultrasonic Drilling B270 Glass Glass Substrate Af45 Af32

Product type: Intrinsic Semiconductor. Application: Solar Cell. Model: tk310.

Overview

The Ultrasonic Drilling B270 Glass Glass Substrate Af45 Af32 is supplied as a drilled / perforated glass plate made from Element Semiconductor. Temperature 550degree C. It is used in Solar Cell. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.

Specifications

Material Element Semiconductor
Type Intrinsic Semiconductor
Parallelism 0.01mm
Application Solar Cell
Thickness 1 0.1mm 0.2mm 0.3mm 0.4mm
Thickess 2 0.5mm 0.7mm 1.1mm
Temperature 550degree C
Model NO. tk310
Surface Clearning 60/40
Surface Roughness 1nm
Manufacturing Technology Optoelectronic Semiconductor
Signal Processing Analog Digital Composite and Function
Model ST
Batch Number 2010+
a) Material BOROFLOAT®33, PYREX7740, quartz glass, Corning Eagle-XG, B270, D262T, AF32,Soda lime
b) Standard thickness 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.7mm, 1.0mm, 1.5mm (thickness tolerance ± 0.02mm)
c) Standard size Φ2", Φ3", Φ4", Φ5", Φ6", Φ8", Φ12" (other sizes can be customized)
d) Appearance 60/40
Supplier Xinyu Xu Tking Glass Co., Ltd.

Technical data

Standard Specification
Size 10 x 10 mm , 20 x 20 mm , 100 x 100 mm 1", 2" , 3" , 4", 5", 6" , 8" Other shapes and sizes also available
Thickness 0.5mm , 0.7 mm or 1.1 mm
Surface finish one side or two sides polished
Flat as SEMI. Std. or without flats
TTV <= 20 um
Surface roughness Ra <= 15 A

What to specify when you request a quote

  • Material — listed as “Element Semiconductor”; name the glass or quartz grade.
  • Outline and thickness — listed as “0.1mm 0.2mm 0.3mm 0.4mm”; give outline, thickness and tolerances.
  • Holes, slots and features — dimension every hole and its position tolerance on the drawing.
  • Edges — state edge finish and chamfer.
  • Surface — listed as “60/40”; state polish and flatness where they matter.

Engineering guides for this part

For material grades and coating options, see Selecting Perforated Quartz Plate Material for Precision Assemblies. How parts like this are machined and finished is covered in Precision Glass Hole Machining for MEMS and Wafer Parts. For an application example, read Why Quartz Glass Components Excel in Coffee Machine Heating Modules. Before sending a drawing, check Choosing Glass Materials for Optical & Industrial Components. A related standard product is Custom Perforated Quartz Plates.

FAQ

What is the Ultrasonic Drilling B270 Glass Glass Substrate Af45 Af32 made of? expand_more
It is listed as Element Semiconductor. Other grades can be quoted if your application needs different transmission, thermal or chemical properties.
Where is this drilled / perforated glass plate used? expand_more
Listed applications: Solar Cell.
What should I include in a quote request? expand_more
Include material, outline and thickness, holes, slots and features, edges and surface, plus quantity and a drawing if the part is custom.
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SP SPEC SUMMARY:
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Save this code before you leave — it is the only way to recall this exact model. If you lose it, your configuration cannot be restored.

SUBMIT RFQ — ENGINEERING REVIEW Your current 3D configuration and specification summary are attached automatically. Attach a drawing if you have one.
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FREQUENTLY ASKED QUESTIONS
What hole patterns can be machined?

Linear rows or circular/array patterns with configurable hole count, diameter and pitch, plus edge finish. Complex layouts can follow a supplied drawing.

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Ultrasonic Drilling B270 Glass Glass Substrate Af45 Af32

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