Model: WGP-AI.
Overview
Wgp Visible Infrared Wire Grid Polarizers on Glass Substrates Nanoimprint Lithography: a waveplate / polariser / grating made from Eagle Xg. Optical / electrical data: wavelength 400-1600nm, transmittance Transmission values are measured at normal incidence at 450 nm, 550 nm, and 650 nm.. Surface quality 60/40 Scratch-Dig. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.
Specifications
| Substrate | Eagle Xg |
|---|---|
| Surface Quality | 60/40 Scratch-Dig |
| Model NO. | WGP-AI |
| Dimensional Tolerance | ±0.2 mm |
| Polarization Wavelength Range | 400-1600nm |
| Extinction Ratio | 800:1(Average Over Wavelength Range) |
| Ar Coating | 450-1000nm |
| Angle of Incidence | 0° ± 20° |
| Thermal Expansion | 37.6 X 10-7/°C |
| Extinction ratio exceeding 800 | 1 ensures clean polarization separation |
| Transmission Reference | Transmission values are measured at normal incidence at 450 nm, 550 nm, and 650 nm. |
| Dimension Tolerance | Applies to length or diameter as applicable to the form factor. |
| CTE Scope | Coefficient of thermal expansion applies to the polarizer and glass cover only (excluding spacers/gaskets). |
| Reliability | Validated for 5,000 hours of continuous operation under specified conditions. |
| Deep silicon etching | aspect ratio 50:1 |
| ICP etching | dielectric-layer etching |
| RIE etching | dielectric-layer etching |
| Metal etching | dielectric-layer etching |
| Metals | Au, Ti, Ni, Cr, Al; |
| dielectric layers | TiN |
| Dielectric | TiO |
| Supplier | Kpl Controlled Environment Solution (Suzhou) Co., Ltd. |
Technical data
| Advantage | Description |
|---|---|
| Broad Wavelength Coverage | Polarization performance from 400 nm to 1600 nm, covering visible, near-IR, and SWIR bands |
| High Extinction Ratio | Extinction ratio exceeding 800:1 ensures clean polarization separation |
| High Transmission | Greater than 82% transmission maximizes optical throughput |
| Exceptional Thermal Stability | Operating temperature range from -40°C to 200°C for harsh environments |
| Wide Acceptance Angle | Performance maintained at incidence angles up to ±20° |
| Precision Surface Quality | Scratch/Dig specification of 60/40 ensures high optical clarity |
| Multiple Form Factors | Available in 12.5 mm square, 25 mm round, 25 mm square, and 50 mm square |
| Parameter | WP12.5L | WP25M | WP25L | WP50L |
| Substrate | EAGLE XG | EAGLE XG | EAGLE XG | EAGLE XG |
| Wavelength Range | 400–1600 nm | 400–1600 nm | 400–1600 nm | 400–1600 nm |
| Extinction Ratio | >800:1 | >800:1 | >800:1 | >800:1 |
| Transmission | >82% | >82% | ±2.5% | >82% |
| Form Factor | 12.5×12.5 mm | Ø25.0 mm | 25.0×25.0 mm | 50.0×50.0 mm |
| Dimension Tolerance | ±0.2 mm | +0.0/-0.1 mm | ±0.2 mm | ±0.2 mm |
| Clear Aperture | 10.5×10.5 mm | Ø19.0 mm | 21.0×21.0 mm | 48.0×48.0 mm |
| Thickness | 1.0 mm | 1.0 mm | 1.0 mm | 1.0 mm |
| Acceptance Angle | 0° ±20° | 0° ±20° | 0° ±20° | 0° ±20° |
| CTE | 37.6×10-7 /°C | 37.6×10-7 /°C | 37.6×10-7 /°C | 37.6×10-7 /°C |
| Surface Quality | 60/40 | 60/40 | 60/40 | 60/40 |
| Operating Temp. | -40 to 200°C | -40 to 200°C | -40 to 200°C | -40 to 200°C |
| Process | Substrate Size | Capability |
| MA8 photolithography | 4 / 6 / 8 inch | Minimum linewidth 1 μm |
| Stepper lithography | 4 inch | Minimum linewidth 0.7 μm |
| Electron-beam lithography (EBL) | 4 inch | Minimum CD 60 nm |
| Laser direct-writing & grayscale lithography | 4 / 6 / 8 inch | 3D grayscale exposure: 4095 levels; writing accuracy 250 nm |
| Dry etching | 4 / 6 / 8 inch | Deep silicon etching: aspect ratio 50:1 ICP etching: dielectric-layer etching RIE etching: dielectric-layer etching Metal etching: dielectric-layer etching |
| Wet etching | 4 / 6 / 8 inch | Silicon etching Metal etching |
| Magnetron sputtering | 4 / 6 / 8 inch | Metals: Au, Ti, Ni, Cr, Al; dielectric layers: TiN |
| Electron-beam evaporation | 4 / 6 / 8 inch | Metals: Au, Pt, Al, Cr, Ti, Ni, etc. |
| Atomic layer deposition (ALD) | 4 / 6 / 8 inch | Dielectric: TiO2, Al2O3, Ta2O5, HfO2, etc. |
| Nanoimprint lithography (NIL) | 4 / 6 / 8 inch | Minimum CD 50 nm |
| Anti-Sticking Treatment | 4 / 6 / 8 inch | CVD and spin-coating processes |
| Metrology & analytical measurement | Sample preparation | SEM, EDS, confocal microscopy, white-light interferometry, step profiler, IR microscopy, metallographic microscopy, etc. |
What to specify when you request a quote
- Material — listed as “Eagle Xg”; name the glass or crystal.
- Geometry — listed as “±0.2 mm”; give diameter, focal length or radii, angles and tolerances.
- Surface figure — listed as “60/40 Scratch-Dig”; quote surface figure (λ) and scratch-dig.
- Centring and edges — state centration and edge chamfer.
- Coating — listed as “450-1000nm”; list the band and reflectance or transmission target.
Engineering guides for this part
For material grades and coating options, see Alkali-Free Glass Options for Electronic & Display Substrate Buyers. How parts like this are machined and finished is covered in Chalcogenide Glass Coating for IR Optical Components. For an application example, read Alkali-Free Glass Wafers for Appliance Display Substrates. A related standard product is Alkali-Free Glass Wafers.


