Borofloat 33 for MEMS Devices: Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um). Single-piece prototypes to production volumes, quoted from your drawing.
What borofloat 33 for mems devices actually buys from a glass shop: cap wafers, TGV substrates, motion-sensor lids. The requirement underneath is anodic-bondable wafers with tight TTV. Borofloat 33 is the fit here because it offers float-glass flatness off the line.
Key parameters
| Material | Borofloat 33 (SCHOTT float production, wafer grade) |
|---|---|
| Thermal expansion (CTE) | 3.25 x 10^-6 /K |
| Service temperature | 450 C continuous |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.23 g/cm3 |
| Knoop hardness | 480 kg/mm2 |
| Refractive index | 1.471 @ 587 nm |
| Stock thickness | 0.70 – 25.4 mm |
| Maximum blank size | 500 x 500 mm |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Specification advice
Before sending the RFQ, check these against your drawing:
- Material note: float tin side must be tracked when parts see coating or bonding steps.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Manufacturing capability
One material, many routes: on Borofloat 33 we also quote dicing, etching, sandblasting, polishing, and multi-step drawings are the norm rather than the exception.
Application context
Orders for borofloat 33 for mems devices cluster in mems devices (cap wafers, TGV substrates, motion-sensor lids); led packaging (groove covers, phosphor carriers, package windows); microfluidic devices (chips, manifolds, via plates, bonded stacks). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Engineers scoping this work usually also review glass wafer bonding, Borofloat 33 selection guide, LED groove cover glass.
Buyer questions, answered
How does Borofloat 33 behave under heat?
CTE is 3.25 x 10^-6 /K and continuous service reaches 450 C continuous, which is what drives its use where float-glass flatness off the line matters.
What do mems devices programs usually order?
Cap wafers, TGV substrates, motion-sensor lids. Typical spec: TTV < 3 um, bow < 20 um, SEMI flats.
Is there a minimum order for borofloat 33 for mems devices?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Specifications on this page were last reviewed by our engineering team in August 2026.