Fused Silica for Microfluidic Devices: Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um). Single-piece prototypes to production volumes, quoted from your drawing.
fused silica for microfluidic devices programs need optically clear, low-autofluorescence channel plates. Fused Silica is the fit here because it offers near-zero thermal expansion. Typical parts: chips, manifolds, via plates, bonded stacks.
Specifications at a glance
| Material | Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR)) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 50 mm |
| Maximum blank size | 450 x 450 mm |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Capabilities and limits
One material, many routes: on Fused Silica we also quote cnc machining, drilling, etching, lapping, and multi-step drawings are the norm rather than the exception.
Specification advice
Three items decide most of the cost and lead time on this work:
- Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Typical applications
The recurring buyers of fused silica for microfluidic devices: laboratory instruments (cuvettes, sight glasses, stir-cell windows); mems devices (cap wafers, TGV substrates, motion-sensor lids); medical diagnostics (flow cells, slides, microplate bottoms, cuvette windows). Background reading on the underlying material science: RP Photonics: fused silica.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
Useful companion pages: fused silica wafers 2-12 inch, glass wafer bonding, ITO coating process.
Buyer questions, answered
How does Fused Silica behave under heat?
CTE is 0.55 x 10^-6 /K and continuous service reaches 1,100 C continuous, which is what drives its use where near-zero thermal expansion matters.
What do microfluidic devices programs usually order?
Chips, manifolds, via plates, bonded stacks. Typical spec: channels from 10 um, bond voids < 1%.
Is there a minimum order for fused silica for microfluidic devices?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Specifications on this page were last reviewed by our engineering team in August 2026.