12 Inch (300 mm) Fused Silica Wafers – Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um); 300 mm format, TTV <5 um. No minimum order; DFM review included with every RFQ.
12 inch (300 mm) fused silica wafers are supplied as finished substrates: edge-rounded, cleaned and packed in wafer cassettes. The material brings near-zero thermal expansion and deep-UV transmission; the format brings SEMI-compatible handling.
Specification envelope
| Material | Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR)) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 50 mm |
| Maximum blank size | 450 x 450 mm |
| Diameter / format | 300 mm |
| Thickness | 0.7 – 1.1 mm |
| TTV | <5 um |
| Flat / notch | SEMI notch |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Manufacturing capability
One material, many routes: on Fused Silica we also quote drilling, laser cutting, sandblasting, lapping, and multi-step drawings are the norm rather than the exception.
Specification advice
Three items decide most of the cost and lead time on this work:
- Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
- Specify flat or notch orientation relative to your device layout – regrinding orientation later scraps the wafer.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Typical applications
12 inch (300 mm) fused silica wafers shows up across scientific instruments (reference flats, cells, prism mounts, stage inserts); laboratory instruments (cuvettes, sight glasses, stir-cell windows); microfluidic devices (chips, manifolds, via plates, bonded stacks). Background reading on the underlying material science: RP Photonics: fused silica.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
Useful companion pages: CNC machining capability, fused silica wafers 2-12 inch, optical polishing capability.
Buyer questions, answered
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Fused Silica parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Its hardness and brittleness demand diamond tooling and controlled feeds.
What thickness range do you stock for Fused Silica?
Standard stock spans 0.10 – 50 mm, with blanks up to 450 x 450 mm. Other formats are sourced per order.
Specifications on this page were last reviewed by our engineering team in September 2026.