Borofloat 33 With Chamfered Holes: Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); 0.1 – 0.5 mm chamfer legs both sides. Single-piece prototypes to production volumes, quoted from your drawing.
Our borofloat 33 with chamfered holes cover the full route from blank to inspected part: sawing, CNC profiling, drilling, grinding, polishing and edge finishing under one roof. Borofloat 33 stands out for float-glass flatness off the line and anodic bonding to silicon, and both properties survive our processing because every step is tuned to the material.
The numbers
| Material | Borofloat 33 (SCHOTT float production, wafer grade) |
|---|---|
| Thermal expansion (CTE) | 3.25 x 10^-6 /K |
| Service temperature | 450 C continuous |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.23 g/cm3 |
| Knoop hardness | 480 kg/mm2 |
| Refractive index | 1.471 @ 587 nm |
| Stock thickness | 0.70 – 25.4 mm |
| Maximum blank size | 500 x 500 mm |
| Feature | Chamfered Holes |
| Capability | 0.1 – 0.5 mm chamfer legs both sides |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Specification advice
Before sending the RFQ, check these against your drawing:
- Material note: float tin side must be tracked when parts see coating or bonding steps.
- Feature rule: chamfers stop hole-edge chips from propagating.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Process window
Beyond this page, Borofloat 33 routinely runs through cnc machining, drilling, etching, lapping in our shop – most real parts combine two or three of these steps.
These features are produced by drilling or edge grinding. Capability: 0.1 – 0.5 mm chamfer legs both sides. Design rule worth copying onto the drawing: chamfers stop hole-edge chips from propagating.
Application context
The recurring buyers of borofloat 33 with chamfered holes: optical sensors (sensor windows, filter caps, lens covers); machine vision (camera windows, ring-light diffusers, calibration plates); mems devices (cap wafers, TGV substrates, motion-sensor lids). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
Useful companion pages: Borofloat 33 selection guide, 4 inch Borofloat wafers, ultra-thin glass materials.
Common questions
How does Borofloat 33 behave under heat?
CTE is 3.25 x 10^-6 /K and continuous service reaches 450 C continuous, which is what drives its use where float-glass flatness off the line matters.
What is the design rule for chamfered holes?
Chamfers stop hole-edge chips from propagating.
Is there a minimum order for borofloat 33 with chamfered holes?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Specifications on this page were last reviewed by our engineering team in August 2026.