Borofloat 33 With Chamfered Holes: Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); 0.1 – 0.5 mm chamfer legs both sides. Single-piece prototypes to production volumes, quoted from your drawing.
Our borofloat 33 with chamfered holes cover the full route from blank to inspected part: sawing, CNC profiling, drilling, grinding, polishing and edge finishing under one roof. Borofloat 33 stands out for float-glass flatness off the line and anodic bonding to silicon, and both properties survive our processing because every step is tuned to the material.
The numbers
| Material | Borofloat 33 (SCHOTT float production, wafer grade) |
|---|---|
| Thermal expansion (CTE) | 3.25 x 10^-6 /K |
| Service temperature | 450 C continuous |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.23 g/cm3 |
| Knoop hardness | 480 kg/mm2 |
| Refractive index | 1.471 @ 587 nm |
| Stock thickness | 0.70 – 25.4 mm |
| Maximum blank size | 500 x 500 mm |
| Feature | Chamfered Holes |
| Capability | 0.1 – 0.5 mm chamfer legs both sides |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Getting the drawing right
Before sending the RFQ, check these against your drawing:
- Material note: float tin side must be tracked when parts see coating or bonding steps.
- Feature rule: chamfers stop hole-edge chips from propagating.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
What the process holds
Beyond this page, Borofloat 33 routinely runs through grinding, polishing, double-side polishing, coring in our shop – most real parts combine two or three of these steps.
These features are produced by drilling or edge grinding. Capability: 0.1 – 0.5 mm chamfer legs both sides. Design rule worth copying onto the drawing: chamfers stop hole-edge chips from propagating.
Typical applications
borofloat 33 with chamfered holes shows up across led packaging (groove covers, phosphor carriers, package windows); machine vision (camera windows, ring-light diffusers, calibration plates); mems devices (cap wafers, TGV substrates, motion-sensor lids). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
For adjacent specifications, see 4 inch Borofloat wafers, Borofloat 33 selection guide, etched LED/OLED covers.
Common questions
Is there a minimum order for borofloat 33 with chamfered holes?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Borofloat 33 parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Float tin side must be tracked when parts see coating or bonding steps.
Specifications on this page were last reviewed by our engineering team in September 2026.