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Borofloat 33 With Precision Holes

Borofloat 33 With Precision Holes: Borofloat 33, CTE 3.25 x 10^-6 /K. No MOQ, prototypes in 5-10 days, DFM review with every RFQ.

Borofloat 33 With Precision Holes

Borofloat 33 With Precision Holes – Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); position +/-0.02 mm, diameter from 0.15 mm. No minimum order; DFM review included with every RFQ.

When a drawing calls out Borofloat 33, three numbers matter before any machining starts: CTE of 3.25 x 10^-6 /K, service temperature to 450 C continuous, and a transmission window of 350 nm – 2.0 um. borofloat 33 with precision holes here begin with those numbers and end with dimensional reports.

Key parameters

Material Borofloat 33 (SCHOTT float production, wafer grade)
Thermal expansion (CTE) 3.25 x 10^-6 /K
Service temperature 450 C continuous
Transmission range 350 nm – 2.0 um
Density 2.23 g/cm3
Knoop hardness 480 kg/mm2
Refractive index 1.471 @ 587 nm
Stock thickness 0.70 – 25.4 mm
Maximum blank size 500 x 500 mm
Feature Precision Holes
Capability position +/-0.02 mm, diameter from 0.15 mm
RFQ inputs PDF/DXF/STEP drawing, quantity brackets, surface and edge spec

DFM notes from the shop floor

Three items decide most of the cost and lead time on this work:

  • Material note: float tin side must be tracked when parts see coating or bonding steps.
  • Feature rule: keep hole-to-edge distance above 1.5x thickness.
  • Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.

The full rules live in our tolerance design guide and holes and edges design guide.

What the process holds

Beyond this page, Borofloat 33 routinely runs through sandblasting, drilling, cnc machining, laser cutting in our shop – most real parts combine two or three of these steps.

These features are produced by drilling or laser cutting. Capability: position +/-0.02 mm, diameter from 0.15 mm. Design rule worth copying onto the drawing: keep hole-to-edge distance above 1.5x thickness.

Typical applications

The recurring buyers of borofloat 33 with precision holes: led packaging (groove covers, phosphor carriers, package windows); machine vision (camera windows, ring-light diffusers, calibration plates); microfluidic devices (chips, manifolds, via plates, bonded stacks). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.

Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.

Useful companion pages: 4 inch Borofloat wafers, wafer dicing process, surface quality guide.

Frequently asked questions

How does Borofloat 33 behave under heat?

CTE is 3.25 x 10^-6 /K and continuous service reaches 450 C continuous, which is what drives its use where float-glass flatness off the line matters.

What is the design rule for precision holes?

Keep hole-to-edge distance above 1.5x thickness.

Is there a minimum order for borofloat 33 with precision holes?

No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.

How fast can prototypes ship?

Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.

What files do you need for a quote?

A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.

Specifications on this page were last reviewed by our engineering team in August 2026.

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FREQUENTLY ASKED QUESTIONS
What hole patterns can be machined?

Linear rows or circular/array patterns with configurable hole count, diameter and pitch, plus edge finish. Complex layouts can follow a supplied drawing.

Need a different product family? Open the full 3D + 2D builder.

Engineering Review

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