Coring Fused Silica – Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um); Coring to diameter +/-0.05 mm. No minimum order; DFM review included with every RFQ.
The combination of Fused Silica and Coring comes up constantly in RFQs for a reason – the material offers deep-uv transmission, and Coring is the right way to get accurate geometry into it. Expect diameter +/-0.05 mm and ground bore, honed option.
The numbers
| Material | Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR)) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 50 mm |
| Maximum blank size | 450 x 450 mm |
| Process | Coring |
| Working tolerance | diameter +/-0.05 mm |
| Minimum feature | 2 mm core diameter |
| Surface finish | ground bore, honed option |
| Thickness window | 1 – 60 mm |
| Edge condition | entry/exit chamfer standard |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Getting the drawing right
Before sending the RFQ, check these against your drawing:
- Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
- Process boundary: wall thickness between adjacent cores should exceed 2 mm to avoid bridge cracking.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Process window
Coring earns its place through large-diameter discs, rings and through-bores from plate stock up to 60 mm thick. Its boundary condition – wall thickness between adjacent cores should exceed 2 mm to avoid bridge cracking – is the first thing our DFM review checks.
Beyond this page, Fused Silica routinely runs through dicing, drilling, polishing, etching in our shop – most real parts combine two or three of these steps.
Where these parts end up
Orders for coring fused silica cluster in semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); medical diagnostics (flow cells, slides, microplate bottoms, cuvette windows); scientific instruments (reference flats, cells, prism mounts, stage inserts). Background reading on the underlying material science: RP Photonics: fused silica.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Related reading on this site: fused silica wafers 2-12 inch, material selection guide, tolerance design guide.
Common questions
What equipment runs the coring work?
Diamond core drills with rotary fixtures.
Is there a minimum order for coring fused silica?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Specifications on this page were last reviewed by our engineering team in September 2026.