Dicing Alkali-Free Glass – Alkali-Free Glass (CTE 3.2 x 10^-6 /K, 350 nm – 2.0 um); Dicing to +/-0.01 mm index accuracy. No minimum order; DFM review included with every RFQ.
dicing alkali-free glass is a materials problem before it is a machining problem. Alkali-Free Glass has no alkali ion migration into tft or sensor layers and a Knoop hardness of 590 kg/mm2, so the dicing recipe – feeds, coolant, tooling – differs from what works on ordinary float glass. The line runs automatic dicing saws with resin and metal-bond blades and holds +/-0.01 mm index accuracy.
Key parameters
| Material | Alkali-Free Glass (AF32 / EAGLE-class display glass) |
|---|---|
| Thermal expansion (CTE) | 3.2 x 10^-6 /K |
| Service temperature | 600 C (Tg 717 C) |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.43 g/cm3 |
| Knoop hardness | 590 kg/mm2 |
| Refractive index | 1.51 @ 587 nm |
| Stock thickness | 0.10 – 1.1 mm |
| Maximum blank size | 400 x 300 mm |
| Process | Dicing |
| Working tolerance | +/-0.01 mm index accuracy |
| Minimum feature | 30 um kerf |
| Surface finish | edge chipping under 15 um |
| Thickness window | 0.05 – 3 mm |
| Edge condition | saw edge, optional etch relief |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Design guidance
The shop-floor rules that matter here:
- Material note: thin sheets below 0.3 mm demand carrier-supported handling through every step.
- Process boundary: straight-line cuts only; contours route to laser cutting instead.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Process window
Dicing earns its place through singulating wafers into dies with tight index accuracy and low chipping. Its boundary condition – straight-line cuts only; contours route to laser cutting instead – is the first thing our DFM review checks.
Beyond this page, Alkali-Free Glass routinely runs through laser cutting, drilling, polishing, etching in our shop – most real parts combine two or three of these steps.
Application context
Orders for dicing alkali-free glass cluster in industrial displays (touch covers, gauge windows, printed bezels); oled packaging (cover lids, frit-seal frames, fill-port plates); mems devices (cap wafers, TGV substrates, motion-sensor lids). Background reading on the underlying material science: SCHOTT AF 32 eco.
Dimensions still moving? Configure this part live in the 3D builder below, or open the full custom glass machining 3D builder to start from a blank canvas.
Useful companion pages: alkali-free glass wafers, wafer dicing process, machining tolerance guide.
Frequently asked questions
What tolerances are achievable on Alkali-Free Glass parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Thin sheets below 0.3 mm demand carrier-supported handling through every step.
What thickness range do you stock for Alkali-Free Glass?
Standard stock spans 0.10 – 1.1 mm, with blanks up to 400 x 300 mm. Other formats are sourced per order.
How does Alkali-Free Glass behave under heat?
CTE is 3.2 x 10^-6 /K and continuous service reaches 600 C (Tg 717 C), which is what drives its use where no alkali ion migration into TFT or sensor layers matters.
What accuracy does dicing hold?
+/-0.01 mm index accuracy with minimum features of 30 um kerf. Straight-line cuts only; contours route to laser cutting instead.
What equipment runs the dicing work?
Automatic dicing saws with resin and metal-bond blades.
Specifications on this page were last reviewed by our engineering team in July 2026.