Dicing Borofloat 33 Wafers – Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); Dicing to +/-0.01 mm index accuracy. No minimum order; DFM review included with every RFQ.
We dice Borofloat 33 daily, in thicknesses from 0.05 – 3 mm. The controlling numbers: +/-0.01 mm index accuracy working tolerance, 30 um kerf minimum features, and edge chipping under 15 um off the machine. Where the drawing asks for more, downstream lapping and polishing take over.
Specifications at a glance
| Material | Borofloat 33 (SCHOTT float production, wafer grade) |
|---|---|
| Thermal expansion (CTE) | 3.25 x 10^-6 /K |
| Service temperature | 450 C continuous |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.23 g/cm3 |
| Knoop hardness | 480 kg/mm2 |
| Refractive index | 1.471 @ 587 nm |
| Stock thickness | 0.70 – 25.4 mm |
| Maximum blank size | 500 x 500 mm |
| Process | Dicing |
| Working tolerance | +/-0.01 mm index accuracy |
| Minimum feature | 30 um kerf |
| Surface finish | edge chipping under 15 um |
| Thickness window | 0.05 – 3 mm |
| Edge condition | saw edge, optional etch relief |
| Wafer formats | 2", 3", 4", 6", 8" and 12" with SEMI flats or notch |
| TTV | under 3 – 5 um by format |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Process window
Dicing earns its place through singulating wafers into dies with tight index accuracy and low chipping. Its boundary condition – straight-line cuts only; contours route to laser cutting instead – is the first thing our DFM review checks.
Beyond this page, Borofloat 33 routinely runs through lapping, ultrasonic machining, coring, etching in our shop – most real parts combine two or three of these steps.
Specification advice
Before sending the RFQ, check these against your drawing:
- Material note: float tin side must be tracked when parts see coating or bonding steps.
- Process boundary: straight-line cuts only; contours route to laser cutting instead.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Application context
dicing borofloat 33 wafers shows up across machine vision (camera windows, ring-light diffusers, calibration plates); optical sensors (sensor windows, filter caps, lens covers); mems devices (cap wafers, TGV substrates, motion-sensor lids). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
For adjacent specifications, see ultra-thin glass materials, wafer dicing process, surface quality guide.
Frequently asked questions
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Borofloat 33 parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Float tin side must be tracked when parts see coating or bonding steps.
What thickness range do you stock for Borofloat 33?
Standard stock spans 0.70 – 25.4 mm, with blanks up to 500 x 500 mm. Other formats are sourced per order.
Specifications on this page were last reviewed by our engineering team in October 2026.