Quick answer: Dicing Fused Silica covers Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um); Dicing to +/-0.01 mm index accuracy. Prototypes ship in 5-10 working days.
Ask any process engineer what makes fused silica difficult and the answer is specific: its hardness and brittleness demand diamond tooling and controlled feeds. Our dicing line is tooled around exactly that – automatic dicing saws with resin and metal-bond blades – holding +/-0.01 mm index accuracy on parts from 0.05 – 3 mm thick.
Specification envelope
| Material | Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR)) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 50 mm |
| Maximum blank size | 450 x 450 mm |
| Process | Dicing |
| Working tolerance | +/-0.01 mm index accuracy |
| Minimum feature | 30 um kerf |
| Surface finish | edge chipping under 15 um |
| Thickness window | 0.05 – 3 mm |
| Edge condition | saw edge, optional etch relief |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Manufacturing capability
The core strength of Dicing is singulating wafers into dies with tight index accuracy and low chipping. The honest limit: straight-line cuts only; contours route to laser cutting instead. Both belong on the drawing before quoting, not after.
One material, many routes: on Fused Silica we also quote double-side polishing, cnc machining, coring, drilling, and multi-step drawings are the norm rather than the exception.
DFM notes from the shop floor
Three items decide most of the cost and lead time on this work:
- Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
- Process boundary: straight-line cuts only; contours route to laser cutting instead.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Who orders this
dicing fused silica shows up across semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); aerospace optics (sensor windows, star-tracker flats, radiation-tolerant ports); machine vision (camera windows, ring-light diffusers, calibration plates). Background reading on the underlying material science: RP Photonics: fused silica.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
Useful companion pages: fused silica wafer applications, fused silica wafers 2-12 inch, laser glass cutting.
Buyer questions, answered
What equipment runs the dicing work?
Automatic dicing saws with resin and metal-bond blades.
Is there a minimum order for dicing fused silica?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Specifications on this page were last reviewed by our engineering team in September 2026.