Double-Side Polishing Quartz Glass – Quartz Glass (CTE 0.59 x 10^-6 /K, 260 nm – 2.5 um); Double-Side Polishing to TTV under 3 um. No minimum order; DFM review included with every RFQ.
Ask any process engineer what makes quartz glass difficult and the answer is specific: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt. Our double-side polishing line is tooled around exactly that – planetary double-side polishers with carrier plates – holding TTV under 3 um on parts from 0.1 – 10 mm thick.
Specification envelope
| Material | Quartz Glass (GE214-equivalent, semiconductor grade) |
|---|---|
| Thermal expansion (CTE) | 0.59 x 10^-6 /K |
| Service temperature | 1,050 C continuous |
| Transmission range | 260 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.459 @ 587 nm |
| Stock thickness | 0.20 – 60 mm |
| Maximum blank size | 450 mm diameter |
| Process | Double-Side Polishing |
| Working tolerance | TTV under 3 um |
| Minimum feature | Ra below 0.5 nm both faces |
| Surface finish | 60/40 to 20/10 both faces |
| Thickness window | 0.1 – 10 mm |
| Edge condition | edge-rounded before DSP |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Process window
Double-Side Polishing earns its place through wafer-grade parallelism and sub-nanometer roughness on both faces simultaneously. Its boundary condition – parts must be round or near-round; strongly asymmetric outlines wedge in the carriers – is the first thing our DFM review checks.
Beyond this page, Quartz Glass routinely runs through dicing, drilling, polishing, etching in our shop – most real parts combine two or three of these steps.
Design guidance
Three items decide most of the cost and lead time on this work:
- Material note: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
- Process boundary: parts must be round or near-round; strongly asymmetric outlines wedge in the carriers.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Typical applications
Orders for double-side polishing quartz glass cluster in semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); laboratory instruments (cuvettes, sight glasses, stir-cell windows). Background reading on the underlying material science: ScienceDirect: quartz glass.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Engineers scoping this work usually also review JGS1 quartz glass, precision glass grinding, wafer dicing process.
Frequently asked questions
What equipment runs the double-side polishing work?
Planetary double-side polishers with carrier plates.
Is there a minimum order for double-side polishing quartz glass?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
Specifications on this page were last reviewed by our engineering team in September 2026.