Edge Grinding Quartz Glass Wafers: Quartz Glass (CTE 0.59 x 10^-6 /K, 260 nm – 2.5 um); Edge Grinding to chamfer +/-0.05 mm. Single-piece prototypes to production volumes, quoted from your drawing.
We edge-grind Quartz Glass daily, in thicknesses from 0.1 – 25 mm. The controlling numbers: chamfer +/-0.05 mm working tolerance, 0.1 mm chamfer leg minimum features, and ground C or R profile, polish option off the machine. Where the drawing asks for more, downstream lapping and polishing take over.
Specifications at a glance
| Material | Quartz Glass (GE214-equivalent, semiconductor grade) |
|---|---|
| Thermal expansion (CTE) | 0.59 x 10^-6 /K |
| Service temperature | 1,050 C continuous |
| Transmission range | 260 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.459 @ 587 nm |
| Stock thickness | 0.20 – 60 mm |
| Maximum blank size | 450 mm diameter |
| Process | Edge Grinding |
| Working tolerance | chamfer +/-0.05 mm |
| Minimum feature | 0.1 mm chamfer leg |
| Surface finish | ground C or R profile, polish option |
| Thickness window | 0.1 – 25 mm |
| Edge condition | C-chamfer, R-round, pencil or OG profile |
| Wafer formats | 2", 3", 4", 6", 8" and 12" with SEMI flats or notch |
| TTV | under 3 – 5 um by format |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
What the process holds
Edge Grinding earns its place through edge strength – a finished chamfer roughly doubles the bend strength of a cut edge. Its boundary condition – profiles below 0.1 mm leg length are lapped by hand and priced per edge – is the first thing our DFM review checks.
Beyond this page, Quartz Glass routinely runs through grinding, sandblasting, double-side polishing, dicing in our shop – most real parts combine two or three of these steps.
Design guidance
Before sending the RFQ, check these against your drawing:
- Material note: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
- Process boundary: profiles below 0.1 mm leg length are lapped by hand and priced per edge.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Where these parts end up
Orders for edge grinding quartz glass wafers cluster in semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); laboratory instruments (cuvettes, sight glasses, stir-cell windows). Background reading on the underlying material science: ScienceDirect: quartz glass.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
For adjacent specifications, see ultra-thin quartz discs, edge grinding overview, 4 inch Borofloat wafers.
Frequently asked questions
What equipment runs the edge grinding work?
CNC edge grinders with profiled diamond wheels.
Is there a minimum order for edge grinding quartz glass wafers?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Specifications on this page were last reviewed by our engineering team in September 2026.