Etching Quartz Glass – Quartz Glass (CTE 0.59 x 10^-6 /K, 260 nm – 2.5 um); Etching to depth control +/-1 um. No minimum order; DFM review included with every RFQ.
The combination of Quartz Glass and Etching comes up constantly in RFQs for a reason – the material offers plasma and halogen resistance, and Etching is the right way to get accurate geometry into it. Expect depth control +/-1 um and isotropic smooth walls.
The numbers
| Material | Quartz Glass (GE214-equivalent, semiconductor grade) |
|---|---|
| Thermal expansion (CTE) | 0.59 x 10^-6 /K |
| Service temperature | 1,050 C continuous |
| Transmission range | 260 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.459 @ 587 nm |
| Stock thickness | 0.20 – 60 mm |
| Maximum blank size | 450 mm diameter |
| Process | Etching |
| Working tolerance | depth control +/-1 um |
| Minimum feature | 10 um channel width (masked HF) |
| Surface finish | isotropic smooth walls |
| Thickness window | 0.1 – 5 mm |
| Edge condition | stress-relief etch available |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Design guidance
The shop-floor rules that matter here:
- Material note: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
- Process boundary: isotropic undercut roughly equals depth, so masks are compensated at layout time.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Manufacturing capability
The core strength of Etching is microchannels, cavities and frosted textures without mechanical stress. The honest limit: isotropic undercut roughly equals depth, so masks are compensated at layout time. Both belong on the drawing before quoting, not after.
One material, many routes: on Quartz Glass we also quote polishing, ultrasonic machining, cnc machining, grinding, and multi-step drawings are the norm rather than the exception.
Who orders this
etching quartz glass shows up across semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); laboratory instruments (cuvettes, sight glasses, stir-cell windows). Background reading on the underlying material science: ScienceDirect: quartz glass.
Dimensions still moving? Configure this part live in the 3D builder below, or open the full custom glass machining 3D builder to start from a blank canvas.
For adjacent specifications, see precision glass grinding, ultra-thin quartz discs, fused silica material guide.
Frequently asked questions
What tolerances are achievable on Quartz Glass parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
What thickness range do you stock for Quartz Glass?
Standard stock spans 0.20 – 60 mm, with blanks up to 450 mm diameter. Other formats are sourced per order.
How does Quartz Glass behave under heat?
CTE is 0.59 x 10^-6 /K and continuous service reaches 1,050 C continuous, which is what drives its use where fused from natural quartz crystal matters.
What accuracy does etching hold?
Depth control +/-1 um with minimum features of 10 um channel width (masked HF). Isotropic undercut roughly equals depth, so masks are compensated at layout time.
Specifications on this page were last reviewed by our engineering team in July 2026.