Fused Silica for MEMS Devices – Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um). No minimum order; DFM review included with every RFQ.
fused silica for mems devices programs need anodic-bondable wafers with tight TTV. Fused Silica is the fit here because it offers near-zero thermal expansion. Typical parts: cap wafers, TGV substrates, motion-sensor lids.
Specification envelope
| Material | Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR)) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 50 mm |
| Maximum blank size | 450 x 450 mm |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Manufacturing capability
One material, many routes: on Fused Silica we also quote coring, lapping, laser cutting, grinding, and multi-step drawings are the norm rather than the exception.
Design guidance
Before sending the RFQ, check these against your drawing:
- Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Where these parts end up
Orders for fused silica for mems devices cluster in optical sensors (sensor windows, filter caps, lens covers); aerospace optics (sensor windows, star-tracker flats, radiation-tolerant ports); mems devices (cap wafers, TGV substrates, motion-sensor lids). Background reading on the underlying material science: RP Photonics: fused silica.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Engineers scoping this work usually also review material selection guide, fused silica material guide, alkali-free display glass.
Buyer questions, answered
How does Fused Silica behave under heat?
CTE is 0.55 x 10^-6 /K and continuous service reaches 1,100 C continuous, which is what drives its use where near-zero thermal expansion matters.
What do mems devices programs usually order?
Cap wafers, TGV substrates, motion-sensor lids. Typical spec: TTV < 3 um, bow < 20 um, SEMI flats.
Is there a minimum order for fused silica for mems devices?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
Specifications on this page were last reviewed by our engineering team in August 2026.