Fused Silica With Chamfered Holes – Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um); 0.1 – 0.5 mm chamfer legs both sides. No minimum order; DFM review included with every RFQ.
Buyers come to fused silica with chamfered holes with two kinds of parts: catalog-adjacent blanks that need accurate finishing, and genuinely custom geometry. We quote both from the same dataset – JGS1 (UV), JGS2 (standard), JGS3 (IR) stock in 0.10 – 50 mm, blanks to 450 x 450 mm.
Specification envelope
| Material | Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR)) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 50 mm |
| Maximum blank size | 450 x 450 mm |
| Feature | Chamfered Holes |
| Capability | 0.1 – 0.5 mm chamfer legs both sides |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Process window
Beyond this page, Fused Silica routinely runs through polishing, drilling, dicing, laser cutting in our shop – most real parts combine two or three of these steps.
These features are produced by drilling or edge grinding. Capability: 0.1 – 0.5 mm chamfer legs both sides. Design rule worth copying onto the drawing: chamfers stop hole-edge chips from propagating.
Getting the drawing right
Three items decide most of the cost and lead time on this work:
- Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
- Feature rule: chamfers stop hole-edge chips from propagating.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Typical applications
Orders for fused silica with chamfered holes cluster in mems devices (cap wafers, TGV substrates, motion-sensor lids); semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); laboratory instruments (cuvettes, sight glasses, stir-cell windows). Background reading on the underlying material science: RP Photonics: fused silica.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Engineers scoping this work usually also review fused silica material guide, fused silica wafer applications, custom FTO glass.
Frequently asked questions
Is there a minimum order for fused silica with chamfered holes?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Fused Silica parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Its hardness and brittleness demand diamond tooling and controlled feeds.
Specifications on this page were last reviewed by our engineering team in September 2026.