Borofloat 33 With Micro Holes: Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); diameter 0.10 – 0.5 mm, arrays past 10,000 holes. Single-piece prototypes to production volumes, quoted from your drawing.
When a drawing calls out Borofloat 33, three numbers matter before any machining starts: CTE of 3.25 x 10^-6 /K, service temperature to 450 C continuous, and a transmission window of 350 nm – 2.0 um. borofloat 33 with micro holes here begin with those numbers and end with dimensional reports.
Specifications at a glance
| Material | Borofloat 33 (SCHOTT float production, wafer grade) |
|---|---|
| Thermal expansion (CTE) | 3.25 x 10^-6 /K |
| Service temperature | 450 C continuous |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.23 g/cm3 |
| Knoop hardness | 480 kg/mm2 |
| Refractive index | 1.471 @ 587 nm |
| Stock thickness | 0.70 – 25.4 mm |
| Maximum blank size | 500 x 500 mm |
| Feature | Micro Holes |
| Capability | diameter 0.10 – 0.5 mm, arrays past 10,000 holes |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Capabilities and limits
One material, many routes: on Borofloat 33 we also quote polishing, etching, edge grinding, sandblasting, and multi-step drawings are the norm rather than the exception.
These features are produced by laser cutting or etching. Capability: diameter 0.10 – 0.5 mm, arrays past 10,000 holes. Design rule worth copying onto the drawing: aspect ratio to 10:1 in a single laser pass.
Design guidance
Three items decide most of the cost and lead time on this work:
- Material note: float tin side must be tracked when parts see coating or bonding steps.
- Feature rule: aspect ratio to 10:1 in a single laser pass.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Typical applications
borofloat 33 with micro holes shows up across optical sensors (sensor windows, filter caps, lens covers); microfluidic devices (chips, manifolds, via plates, bonded stacks); mems devices (cap wafers, TGV substrates, motion-sensor lids). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Related reading on this site: 4 inch Borofloat wafers, wafer dicing process, holes and edges design guide.
Common questions
How does Borofloat 33 behave under heat?
CTE is 3.25 x 10^-6 /K and continuous service reaches 450 C continuous, which is what drives its use where float-glass flatness off the line matters.
What is the design rule for micro holes?
Aspect ratio to 10:1 in a single laser pass.
Is there a minimum order for borofloat 33 with micro holes?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Specifications on this page were last reviewed by our engineering team in August 2026.