Precision Glass Thickness Control – thickness +/-0.003 mm via lapping and DSP. No minimum order; DFM review included with every RFQ.
Drawings fail at the tolerance block more than anywhere else. For precision glass thickness control the achievable envelope is thickness +/-0.003 mm via lapping and DSP – the method is double-side processing with gauging.
The numbers
| Held tolerance | thickness +/-0.003 mm via lapping and DSP |
|---|---|
| Method | double-side processing with gauging |
| Reference standard | SEMI wafer thickness grades |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Specification advice
Three items decide most of the cost and lead time on this work:
- Cite SEMI wafer thickness grades on the drawing so both sides measure the same way.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Where these parts end up
precision glass thickness control shows up across laboratory instruments (cuvettes, sight glasses, stir-cell windows); aerospace optics (sensor windows, star-tracker flats, radiation-tolerant ports); ccd inspection equipment (CCD cover plates, reference grids, stage glass).
If the part is easier to draw than describe, the custom glass machining 3D + 2D builder turns dimensions into an RFQ in a few minutes.
Useful companion pages: holes and edges design guide, etched LED/OLED covers, custom ITO glass.
Common questions
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
Which standard governs this?
SEMI wafer thickness grades, verified by double-side processing with gauging.
Specifications on this page were last reviewed by our engineering team in August 2026.