Product type: Intrinsic Semiconductor. Application: Solar Cell. Model: ST.
Overview
0.2mm Borosilicate Glass Wafer for Mems is a fused silica / quartz wafer made from Element Semiconductor. Temperature 550degree C. Listed for Solar Cell applications. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.
Specifications
| Material | Element Semiconductor |
|---|---|
| Type | Intrinsic Semiconductor |
| Parallelism | 0.01mm |
| Application | Solar Cell |
| Thickness 1 | 0.1mm 0.2mm 0.3mm 0.4mm |
| Thickess 2 | 0.5mm 0.7mm 1.1mm |
| Temperature | 550degree C |
| Surface Clearning | 60/40 |
| Surface Roughness | 1nm |
| Manufacturing Technology | Optoelectronic Semiconductor |
| Signal Processing | Analog Digital Composite and Function |
| Model | ST |
| Batch Number | 2010+ |
| l Typical application | Micro-optics |
| a) Material | BOROFLOAT®33, PYREX7740, quartz glass, Corning Eagle-XG, B270, D262T, AF32,Soda lime |
| b) Standard thickness | 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.7mm, 1.0mm, 1.5mm (thickness tolerance ± 0.02mm) |
| c) Standard size | Φ2", Φ3", Φ4", Φ5", Φ6", Φ8", Φ12" (other sizes can be customized) |
| d) Appearance | 60/40 |
| Supplier | Xinyu Xu Tking Glass Co., Ltd. |
What to specify when you request a quote
- Diameter and flat / notch — listed as “Φ2", Φ3", Φ4", Φ5", Φ6", Φ8", Φ12" (other sizes can be customized)”; state diameter, flat or notch and their tolerances.
- Thickness and TTV — listed as “0.1mm 0.2mm 0.3mm 0.4mm”; give thickness, its tolerance and total thickness variation.
- Polish and roughness — listed as “60/40”; specify single- or double-side polish and roughness.
- Flatness, bow and warp — quote flatness, bow and warp limits.
- Material grade — listed as “Element Semiconductor”; name the grade (JGS1/JGS2, Borofloat 33, alkali-free, sapphire orientation).
Engineering guides for this part
For material grades and coating options, see Fused Quartz Wafer Substrate Selection: Materials & Coatings for Semiconductor and Optical Systems. How parts like this are machined and finished is covered in Precision Glass Hole Drilling & Micromachining for MEMS Wafers. For an application example, read Fused Silica Glass Wafers for Precision Appliance Electronics. Before sending a drawing, check Precision Glass Material Selection: Fused Silica vs Borosilicate & More. A related standard product is Custom Ultra-Thin Quartz Glass Disc.
