Product type: N-Type Semiconductor. Application: GaN Epitaxy Growth.
Overview
3 Inch Sapphire Wafer C-Plane Epi Ready LED Substrate DSP/Ssp is a sapphire / specialty wafer made from Compound Semiconductor. Listed geometry: size 3 Inch, round shape. It is used in GaN Epitaxy Growth. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.
Specifications
| Material | Compound Semiconductor |
|---|---|
| Type | N-Type Semiconductor |
| Shape | Round |
| Size | 3 Inch |
| Application | GaN Epitaxy Growth |
| Surface Treatment | Ssp or DSP |
| Growth Method | Ky |
| Orientation | C Plane |
| Manufacturing Technology | Optoelectronic Semiconductor |
| Crystal materials | 99, 996% of Al2O3, High Purity, Monocrystalline |
| Growth growth | KY |
| Manufacture | Our cleanning machine Smartron from Korea |
| Supplier | Jiaozuo Commercial Finewin Co., Ltd. |
Technical data
| Crystal materials | 99, 996% of Al2O3, High Purity, Monocrystalline |
|---|---|
| Crystal quality | Block marks, twins, Color, micro-bubbles and dispersal centers are non-existent |
| Diameter | 76.2±0.2mm |
| Thickness | 330±15 μ M, 430±15 μ M, 500±15 μ M |
| Orientation | C-plane, M-plane, A-plane, R-plane, C-plane off M-plane, C-plane off A-plane |
| Primary flat Orientation | A-plane (1 1-2 0) ± 0.2° |
| Primary flat length | 22.0±1.0 mm, |
| TTV | ≤ 15 μ M, |
| LTV | ≤ 15 μ M |
| BOW | ≤ 15 μ M |
| Warp | ≤ 15 μ M |
| Front Surface Back Surface | Epi-polished, Ra< 0.2nm (By AFM) Fine ground (Ra=0.5 to 1.2 μ M) or Epi-polished (Ra< 0.2 nm) |
| Cleaning/packaging | Class 100 clean room cleaning, vacuum packaging; 25 pieces in one cassette packaging or individual packaging. |
What to specify when you request a quote
- Diameter and flat / notch — listed as “3 Inch”; state diameter, flat or notch and their tolerances.
- Thickness and TTV — give thickness, its tolerance and total thickness variation.
- Polish and roughness — listed as “Ssp or DSP”; specify single- or double-side polish and roughness.
- Flatness, bow and warp — quote flatness, bow and warp limits.
- Material grade — listed as “Compound Semiconductor”; name the grade (JGS1/JGS2, Borofloat 33, alkali-free, sapphire orientation).
Engineering guides for this part
For material grades and coating options, see Fused Quartz Wafer Substrate Selection: Materials & Coatings for Semiconductor and Optical Systems. How parts like this are machined and finished is covered in Precision Glass Hole Machining for MEMS and Wafer Parts. For an application example, read Laser Cut Glass Covers: The Key to Durable Appliance LED Packaging. A related standard product is LED Groove Cover Glass.
