Product type: Quartz Plate. Application: Chemical, Glass. Model: HB-QP.
Overview
Circular Customize Silica Glass Plate Frosty Fused Quartz Wafer for Semiconductor is a fused silica / quartz wafer. Temperature 1100 Degree. Listed for Chemical and Glass applications. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.
Specifications
| Type | Quartz Plate |
|---|---|
| Application | Chemical, Glass |
| Model NO. | HB-QP |
| Purity | 99.99% |
| Long Time Working Temperature | 1100 Degree |
| Short Time Working Temperature | 1200 Degree |
| Density | 2.21g/cm3 |
| Strain Point | 1120 Degree |
| Softening Point | 1680 Degree |
| Anneal Point | 1180 Degree |
| Color | Clear |
| Mohs Hardness | 6 |
| Poisson Ratio | 0.17 |
| Keyword1 | Frosty Quartz Wafer |
| Keyword2 | Frosty Silica Quartz Plate |
| frosty fused silica quartz wafer | 1. Both sides grind frosty |
| Supplier | Lianyungang Highborn Technology Co., Ltd. |
Technical data
| Compressive Strength | >1100Mpa | Coefficient of thermal expansion | 5.5×10-7cm/cm.°C |
| Bending Strength | 67Mpa | Hot work temperature | 1750~2050°C |
| Tensile Strength | 48.3Mpa | The temperature for a short time | 1200°C |
| Poisson's Ratio | 0.14~0.17 | The temperature for a long time | 1100°C |
| Elastic Modulus | 71700Mpa | Resistivity | 7×107Ω.cm |
| Shearing Modulus | 31000Mpa | Dielectric Strength | 250~400Kv/cm |
| Moths Hardness | 5.3~6.5(Moths Scale) | Dielectric Constant | 3.7~3.9 |
| Deformation Point | 1350°C | Dielectric absorption coefficient | <4×104 |
| Specific Heat(20~350°C) | 670J/kg °C | Dielectric loss coefficient | <1×104 |
| Product | frosty silica quartz plate |
|---|---|
| Purity | 99.99% |
| long time working temperature | 1100 degree |
| short time working temperature | 1200 degree |
| standard Size | OD45 or customize |
| thickness | 1mm/2mm/3mm |
| 1. High-quality products | 2. Optimal price | 3.SafeTransportation |
| 4. Sample service | 5. Customized size | 6. Compensate for broken goods |
| 7. Safe package | 8. Transportation safety | 9. Low procurement risk |
What to specify when you request a quote
- Diameter and flat / notch — state diameter, flat or notch and their tolerances.
- Thickness and TTV — give thickness, its tolerance and total thickness variation.
- Polish and roughness — specify single- or double-side polish and roughness.
- Flatness, bow and warp — quote flatness, bow and warp limits.
- Material grade — name the grade (JGS1/JGS2, Borofloat 33, alkali-free, sapphire orientation).
Engineering guides for this part
For material grades and coating options, see Fused Quartz Wafer Substrate Selection: Materials & Coatings for Semiconductor and Optical Systems. How parts like this are machined and finished is covered in Precision CNC Machining of Quartz & Fused Silica Components. For an application example, read Fused Silica Glass Wafers for Precision Appliance Electronics. Before sending a drawing, check Fused Silica Refractive Index: Key to Optical Design Improvement. A related standard product is Custom Ultra-Thin Quartz Glass Disc.
