SKU MG-0B427A

Clear Silica Quartz Disk Pads for Wafer Friction Handling of Substrates

Clear Silica Quartz Disk Pads for Wafer Friction Handling of Substrates — a fused silica / quartz wafer: Cordierite. Specs, RFQ checklist and custom sizes…

CordieriteMaterial
Ceramic TubeType
CustomizedSize
Architectural, Electronics, RefractoryApplication
Clear Silica Quartz Disk Pads for Wafer Friction Handling of Substrates

Product type: Ceramic Tube. Application: Architectural, Electronics, Refractory. Model: G-E689.

Overview

Clear Silica Quartz Disk Pads for Wafer Friction Handling of Substrates is a fused silica / quartz wafer made from Cordierite. Listed geometry: size Customized. It is used in Architectural, Electronics and Refractory. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.

Specifications

Material Cordierite
Type Ceramic Tube
Size Customized
Application Architectural, Electronics, Refractory
Color White, Black, Brown, Red, Gold, Yellow, Green
Model NO. G-E689
Feature High Electrical Resistance
Usge Insulation in The Electrical and Electronic Indust
Characteristic 1.High temperature resistance
Supplier Shanghai Yunnuo Industrial Co., Ltd.

Technical data

Item Value
Density 2.2 g/cm3
Moh's hardness 5-7
Compressive strength 800-1100 mpa
Flexural strength 60-70 mpa
Tensile strength 49 mpa
Poisson's ratio 0.14-0.17
Young's modulus 72000 mpa
Modulus of rigidity 31000 mpa
Specific heat (20-350C) 670 J/KG.C
Thermal conductivity (20C) 1.4W/m.C
Refractive index 1.4585
Resistivity 7×107 Ω.cm
Dielectric strength 250-400Kw/cm
Dielectric constant 3.7-3.9

What to specify when you request a quote

  • Diameter and flat / notch — listed as “Customized”; state diameter, flat or notch and their tolerances.
  • Thickness and TTV — give thickness, its tolerance and total thickness variation.
  • Polish and roughness — specify single- or double-side polish and roughness.
  • Flatness, bow and warp — quote flatness, bow and warp limits.
  • Material grade — listed as “Cordierite”; name the grade (JGS1/JGS2, Borofloat 33, alkali-free, sapphire orientation).

Engineering guides for this part

For material grades and coating options, see Fused Silica Wafer Production: A Step-by-Step Manufacturing Guide. How parts like this are machined and finished is covered in Glass Wafer Coring for Custom Circular Components. For an application example, read Fused Silica Glass Wafers for Precision Appliance Electronics. Before sending a drawing, check Fused Silica Refractive Index: Key to Optical Design Improvement. A related standard product is Custom Ultra-Thin Quartz Glass Disc.

FAQ

What is the Clear Silica Quartz Disk Pads for Wafer Friction Handling of Substrates made of? expand_more
It is listed as Cordierite. Other grades can be quoted if your application needs different transmission, thermal or chemical properties.
What sizes and thicknesses are available? expand_more
The listing gives size Customized. Custom outlines and thicknesses are made to drawing; state the tolerance you need.
Where is this fused silica / quartz wafer used? expand_more
Listed applications: Architectural, Electronics and Refractory.
What should I include in a quote request? expand_more
Include diameter and flat / notch, thickness and ttv, polish and roughness, flatness, bow and warp and material grade, plus quantity and a drawing if the part is custom.
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FREQUENTLY ASKED QUESTIONS
Which fused silica grade should I choose — JGS1, JGS2 or JGS3?

JGS1 offers deep-UV transmission from about 185 nm (best for DUV lithography and UV laser optics). JGS2 transmits well from about 220 nm for standard UV-visible use at lower cost. JGS3 is optimized for visible-to-infrared and high-power laser work. The builder exposes a transmission-band requirement so you can specify the grade by application.

What wafer diameters and thicknesses are supported?

Common diameters are 2, 3, 4 and 6 inch (note 1 inch = 25.0 mm for quartz wafers, so a 4 inch wafer is 100 mm). Typical thicknesses are 200, 500, 700 and 1000 µm, with tighter thickness tolerance and TTV specifiable for polished optical grades.

Can I specify TTV, surface quality and a flat or notch?

Yes. You can set total thickness variation, scratch-dig surface quality (down to 40/20 or 20/10 for optical grade), single- or double-side polish, and a primary flat or notch for orientation.

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Clear Silica Quartz Disk Pads for Wafer Friction Handling of Substrates

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