Product type: Silicon Wafer Substrate. Application: Temperature Measurment & Optics Applying. Model: OC-0021.
Overview
Custom Silicon Carbide Substrate N-Type P-Type Sapphire Wafer Diameter 4-8 Inch Thickness 0.35-0.5 mm Sic Wafer: a sapphire / specialty wafer in Element Semiconductor (Monocrystalline Silicon substrate). Listed geometry: diameter 1mm – 500mm (standard sizes available, custom dimensions supported). Surface quality Polished to Ra ≤ 0.01μm, no scratches, bubbles, or impurities. Typical applications: Temperature Measurment & Optics Applying. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.
Specifications
| Material | Element Semiconductor |
|---|---|
| Substrate | Monocrystalline Silicon |
| Type | Silicon Wafer Substrate |
| Surface Quality | Polished to Ra ≤ 0.01μm, no scratches, bubbles, or impurities |
| Parallelism | Less Than 1 Arc Min |
| Application | Temperature Measurment & Optics Applying |
| Conductivity Type | All |
| Model NO. | OC-0021 |
| Purity | SoG-Si |
| Size Tolerance | 0/-0.15mm |
| Thickness Tolerance | +/-0.05mm |
| Surface Finish | 60-40 Scratch-Dig |
| Manufacturing Technology | Optoelectronic Semiconductor |
| Diameter Range | 1mm – 500mm (standard sizes available, custom dimensions supported) |
| Optical Performance | High light transmittance (≥92% for visible light), low chromatic aberration, precise focal length |
| Tolerance | Dimensional tolerance ±0.02mm, focal length tolerance ±1% |
| Coating Option | Anti-reflective coating (AR coating), hydrophobic coating, or custom coating as per request |
| Industrial Equipment | Laser marking machines, cutting machines, engraving machines, optical sensors |
| Electronic Devices | Cameras, projectors, optical communication equipment, medical imaging devices |
| Automotive Industry | Vehicle-mounted cameras, HUD (Head-Up Display) systems |
| Aerospace | Optical detection equipment, satellite communication systems |
| Supplier | C-Laser (Taicang) Material Technology Co., Ltd. |
Technical data
| Technical Data | Description & Value |
|---|---|
| Substrate | Monocrystalline silicon |
| Size Tolerance | 0/-0.15mm |
| Thickness Tolerance | +/-0.05mm |
| Parallelism | Less than 1 arc min |
| Surface Finish | 60-40 scratch-dig |
| Coating | 4" or 6" |
What to specify when you request a quote
- Diameter and flat / notch — listed as “0/-0.15mm”; state diameter, flat or notch and their tolerances.
- Thickness and TTV — listed as “+/-0.05mm”; give thickness, its tolerance and total thickness variation.
- Polish and roughness — listed as “Polished to Ra ≤ 0.01μm, no scratches, bubbles, or impurities”; specify single- or double-side polish and roughness.
- Flatness, bow and warp — quote flatness, bow and warp limits.
- Material grade — listed as “Element Semiconductor”; name the grade (JGS1/JGS2, Borofloat 33, alkali-free, sapphire orientation).
Engineering guides for this part
For material grades and coating options, see Fused Quartz Wafer Substrate Selection: Materials & Coatings for Semiconductor and Optical Systems. How parts like this are machined and finished is covered in Precision Glass Hole Drilling & Micromachining for MEMS Wafers. Before sending a drawing, check Technical Guide to Glass Thickness and Flatness Requirements.
