Product type: Quartz Plate. Application: Chemical, Construction, Metallurgy, Casting, Glass, Well Drilling, Decorations, Heater, Printer. Model: HB-QP.
Overview
The Customized Round Laser Drilling Semiconductor Jgs1 Jgs2 Clear Quartz Glass Wafer is supplied as a fused silica / quartz wafer made from Quartz. Listed geometry: size 5-1500mm, round shape. Optical / electrical data: sheet resistance 1200 degree C. Surface quality Polishing; temperature 1100 Degree. Listed for Chemical, Construction, Metallurgy, Casting and Glass applications. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.
Specifications
| Material | Quartz |
|---|---|
| Type | Quartz Plate |
| Shape | Round |
| Size | 5-1500mm |
| Dimension | Can Be Customized |
| Surface Quality | Polishing |
| Application | Chemical, Construction, Metallurgy, Casting, Glass, Well Drilling, Decorations, Heater, Printer |
| Usage | Semiconductor |
| Model NO. | HB-QP |
| Color | Transparent |
| Edge | Can Be Flamed |
| Temperature | 1100 Degree |
| Two Sides | Polishing or Grind |
| Surface | No Airline, No Bubbles |
| Sio2 | > 99.99% |
| Density | 2.21 |
| Keyword | Clear Quartz Glass Wafer |
| Strain point | 1075°C=1967°F |
| Heat resistant temperature | 1200 degree C |
| The thickness | 0.5-50mm |
| Quartz disc | 10-500mm diameter |
| Main Appilication | Used for window material,mask substrate or heat insulation,optics,electronics,medical treatment,laser industries ect. |
| Further process of quartz glass panel | We can do edge flame polishing, optical polishing, grind, general polishing, two sides polishing, one side polishing and the other side grind. |
| ISO 9001 | 2015 and IATF 16949 |
| ISO9001 | 2015 Quality Management System |
| Period of validity | from2024.10.17 to 2027.10.25 |
| Date | MAY .08.2026 |
| Supplier | Lianyungang Highborn Technology Co., Ltd. |
Technical data
| Property Content | Unit | Property Index |
| Density | g/cm3 | 2.21 |
| Tensile Strength | Pa(N/m2) | 4.9×107 |
| CompressiveStrength | Pa | >1.1×109 |
| (20℃-300℃)Coefficient of Thermal Expansion | /K | 5.5×10−7 |
| (20℃)Thermal Conductivity | W/(m·K) | 1.4 |
| (20℃)Specific Heat | J/(kg·K) | 680 |
| Softening Point | ℃ | 1700 |
| Annealing Point | ℃ | 1210 |
What to specify when you request a quote
- Diameter and flat / notch — listed as “5-1500mm”; state diameter, flat or notch and their tolerances.
- Thickness and TTV — listed as “0.5-50mm”; give thickness, its tolerance and total thickness variation.
- Polish and roughness — listed as “Polishing”; specify single- or double-side polish and roughness.
- Flatness, bow and warp — quote flatness, bow and warp limits.
- Material grade — listed as “Quartz”; name the grade (JGS1/JGS2, Borofloat 33, alkali-free, sapphire orientation).
Engineering guides for this part
For material grades and coating options, see Selecting Perforated Quartz Plate Material for Precision Assemblies. How parts like this are machined and finished is covered in Custom Perforated Quartz Plate Manufacturing Process Explained. For an application example, read Fused Silica Glass Wafers for Precision Appliance Electronics. Before sending a drawing, check Quartz Glass Manufacturing: Controlling Thermal Conductivity in Fused Silica. A related standard product is 2× 100 mm JGS1 & JGS2 Quartz Glass Sheets.
