Factory Custom Thin Thickness 300 mm Wafer Glass Wafer Silicon Wafers Manufacturing is a glass wafer made from Borosilicate Glass (Borofloat 33). Listed geometry: diameter 150mm ± 0.2mm, thickness 500±25µm. Surface quality Scratch-Dig 40/20. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.
Specifications
Material
Borosilicate Glass (Borofloat 33)
Diameter
150mm ± 0.2mm
Thickness
500±25µm
Surface Quality
Scratch-Dig 40/20
Model NO.
12inch
Edge
Polished
Bow
≤25µm
Warp
≤25µm
Ttv
≤5µm
Frront Side
Polished
Key Specifications
Specification
Key Features
High Thermal Resistance
Supplier
Fine Silicon Manufacturing(Shanghai)Ltd.
Technical data
Specification
Value
Material
Borosilicate Glass (Borofloat 33)
Diameter
150mm ± 0.2mm
Surface Quality
Scratch-Dig 40/20
BOW
≤25µm
WARP
≤25µm
TTV
≤5µm
Thermal Properties
Low coefficient of thermal expansion
Chemical Resistance
High resistance to water, acids, and organic substances
Transparency
High transparency in the visible and near-infrared spectrum
Packaging
Cleanroom packed, individual cassettes
Item
Specification
Diameter
150mm
200mm
300mm
Type
P/N
P/N
P/N
Notch
SEMI/JEIDA
Notch/OF
Notch
Thickness(μm)
675±25/625±25
725±25
725±25
Surface
Polished
Polished
Polished
Inside
Etched
Etched
Etched
Package
CoinRoll
CoinRoll
CoinRoll
150MM
SPEC
0.2um≤30ea
Diameter(mm)
150±0.2mm
Type
P
Olyfra length
57.5mm±2.5mm
47.5mm±2.5mm
Resistance value ( Ω·cm )
1-100
Thickness(μm)
SEMI
JEIDA
675um±25um
675um±25um
TTV(μm)
≤30um
BOW(μm)
≤40um
WARP(μm)
≤40um
Surface impurity
≤5.0E 10 atom/cm²
What to specify when you request a quote
Diameter and flat / notch — listed as “150mm ± 0.2mm”; state diameter, flat or notch and their tolerances.
Thickness and TTV — listed as “500±25µm”; give thickness, its tolerance and total thickness variation.
Polish and roughness — listed as “Scratch-Dig 40/20”; specify single- or double-side polish and roughness.
Flatness, bow and warp — listed as “≤25µm”; quote flatness, bow and warp limits.
Material grade — listed as “Borosilicate Glass (Borofloat 33)”; name the grade (JGS1/JGS2, Borofloat 33, alkali-free, sapphire orientation).
What is the Factory Custom Thin Thickness 300 mm Wafer Glass Wafer Silicon Wafers Manufacturing made of? expand_more
It is listed as Borosilicate Glass (Borofloat 33). Other grades can be quoted if your application needs different transmission, thermal or chemical properties.
What sizes and thicknesses are available? expand_more
The listing gives diameter 150mm ± 0.2mm, thickness 500±25µm. Custom outlines and thicknesses are made to drawing; state the tolerance you need.
What should I include in a quote request? expand_more
Include diameter and flat / notch, thickness and ttv, polish and roughness, flatness, bow and warp and material grade, plus quantity and a drawing if the part is custom.
Configure in 3D, draw in 2D
3D Model & 2D Drawing Builder
PRECISION GLASS3D
3D Precision Glass ConfiguratorBuild a visual 3D preview for custom precision glass parts, including wafers, microfluidic chips, coated glass, optical filters, and machined quartz plates.This tool is for visual configuration only. Final dimensions, tolerances, materials, coatings, and manufacturability will be reviewed from your drawing or specification.
Paste a configuration JSON (from Export) or a copied RFQ summary. The product and all recognized parameters are applied automatically; unknown parameters are listed and skipped.
Answer the choices below step by step — every value comes from the real option list, so it always renders.
Save the current configuration under a name and recall it any time on this device.
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Glass Wafer Builder
Interactive visual preview for custom precision glass configuration.
CMD
Import Code (One-Click Recall)
Save this code before you leave — it is the only way to recall this exact model. If you lose it, your configuration cannot be restored.
SUBMIT RFQ — ENGINEERING REVIEWYour current 3D configuration and specification summary are attached automatically. Attach a drawing if you have one.
FREQUENTLY ASKED QUESTIONSWhich fused silica grade should I choose — JGS1, JGS2 or JGS3?
JGS1 offers deep-UV transmission from about 185 nm (best for DUV lithography and UV laser optics). JGS2 transmits well from about 220 nm for standard UV-visible use at lower cost. JGS3 is optimized for visible-to-infrared and high-power laser work. The builder exposes a transmission-band requirement so you can specify the grade by application.
What wafer diameters and thicknesses are supported?
Common diameters are 2, 3, 4 and 6 inch (note 1 inch = 25.0 mm for quartz wafers, so a 4 inch wafer is 100 mm). Typical thicknesses are 200, 500, 700 and 1000 µm, with tighter thickness tolerance and TTV specifiable for polished optical grades.
Can I specify TTV, surface quality and a flat or notch?
Yes. You can set total thickness variation, scratch-dig surface quality (down to 40/20 or 20/10 for optical grade), single- or double-side polish, and a primary flat or notch for orientation.
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