Product type: N-Type Semiconductor. Application: LED. Model: 2 inch.
Overview
R Plane Sapphire Wafer 2 Inch Epi Ready LED Substrate is a sapphire / specialty wafer made from Compound Semiconductor. Listed geometry: size 2 Inch. Typical applications: LED. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.
Specifications
| Material | Compound Semiconductor |
|---|---|
| Type | N-Type Semiconductor |
| Size | 2 Inch |
| Application | LED |
| Manufacturing Technology | Optoelectronic Semiconductor |
| Model NO. | 2 inch |
| Materials | Sapphire Al2O3 |
| Surface Treatment | Ssp or DSP |
| Growth Method | Ky |
| Orientation | C Plane |
| Crystal materials | 99, 996% of Al2O3, High Purity, Monocrystalline |
| Growth growth | KY |
| Related products | 1. 2inch, 3inch, 4inch & 6inch C plane sapphire substrates |
| Manufacture | Our cleanning machine Smartron from Korea |
| Supplier | Jiaozuo Commercial Finewin Co., Ltd. |
Technical data
| Crystal materials | 99, 996% of Al2O3, High Purity, Monocrystalline |
|---|---|
| Crystal quality | Block marks, twins, Color, micro-bubbles and dispersal centers are non-existent |
| Diameter | 50.8±0.2mm 76.2±0.2mm 100.0±0.3mm 150.0±0.3mm |
| Thickness | 430±15 μ m, 500±15 μ m, 550±15 μm, 650±15 μm,1000±15 μm |
| Orientation | C-plane, M-plane, A-plane, R-plane, C-plane off M-plane, C-plane off A-plane |
| Primary flat Orientation | A-plane (1 1-2 0) ± 0.2° |
| Primary flat length | 16.0±1.5 mm, 32.50±1.5 mm, |
| TTV | ≤ 10 μm |
| LTV | ≤ 10 μm |
| BOW | ≤ 10 μm |
| Warp | ≤ 10 μm |
| Front Surface Back Surface | Epi-polished, Ra< 0.2nm (By AFM) Fine ground (Ra=0.5 to 1.2 μ M) or Epi-polished (Ra< 0.2 nm) |
| Cleaning/packaging | Class 100 clean room cleaning, vacuum packaging; 25 pieces in one cassette packaging or individual packaging. |
What to specify when you request a quote
- Diameter and flat / notch — listed as “2 Inch”; state diameter, flat or notch and their tolerances.
- Thickness and TTV — give thickness, its tolerance and total thickness variation.
- Polish and roughness — listed as “Ssp or DSP”; specify single- or double-side polish and roughness.
- Flatness, bow and warp — quote flatness, bow and warp limits.
- Material grade — listed as “Compound Semiconductor”; name the grade (JGS1/JGS2, Borofloat 33, alkali-free, sapphire orientation).
Engineering guides for this part
For material grades and coating options, see Fused Quartz Wafer Substrate Selection: Materials & Coatings for Semiconductor and Optical Systems. How parts like this are machined and finished is covered in Precision Glass Hole Drilling & Micromachining for MEMS Wafers. For an application example, read Laser Cut Glass Covers for Appliance LED Packaging: A Buyer’s Guide. A related standard product is LED Groove Cover Glass.
