SKU MG-74F8EB

Sapphire (Al2O3) Glass Wafer Substrate 2inch 0.50mm Thickness Ssp & DSP C-Plane

Sapphire (Al2O3) Glass Wafer Substrate 2inch 0.50mm Thickness Ssp & DSP C-Plane — a sapphire / specialty wafer: Moonocrystalline Al2o, High Purity…

Moonocrystalline Al2o, High PurityMaterial
Quartz PlateType
10mm-200mmDiameter
0.43mm-1.3mmThickness
Sapphire (Al2O3) Glass Wafer Substrate 2inch 0.50mm Thickness Ssp & DSP C-Plane

Product type: Quartz Plate. Application: Glass. Model: Sapphire(Al2O3) glass wafe.

Overview

Sapphire (Al2O3) Glass Wafer Substrate 2inch 0.50mm Thickness Ssp & DSP C-Plane is a sapphire / specialty wafer made from Moonocrystalline Al2o, High Purity. Listed geometry: diameter 10mm-200mm, thickness 0.43mm-1.3mm. It is used in Glass. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.

Specifications

Material Moonocrystalline Al2o, High Purity
Type Quartz Plate
Diameter 10mm-200mm
Thickness 0.43mm-1.3mm
Application Glass
Model NO. Sapphire(Al2O3) glass wafe
Ttv <10um
Warp <20um
Bow <20um
Surface Finish Ssp/DSP
Supplier Hangzhou Freq-Control Electronic Technology Ltd.

Technical data

Material 99,999% of Al2O3,High Purity,Moonocrystalline Al2O3
Surface Orientation C-plane(0001) to M-plane(1-100)or A-plane( 11-20) 0.2 +/- 0.1°, R-plane(1-102),
Diameter/size 2"(50.8mm) 3"(76.2mm) 4" (100mm) 5" (125mm) 6"(150mm) 8"(200mm)
Tol(±) 0.10mm
Thickness 430 μm +/- 25 μm 500 μm +/- 25 μm 650 μm +/- 25 μm 650 μm +/- 25 μm 1300μm +/-25 μm 1300μm +/- 25μm
Primary Flat Orientatoin A-Plane(11-20)+/- 0.2°
Primary Flat Length 16.0 mm +/- 1.0 mm 22.0 mm +/- 1.0 mm 30.0 mm +/- 1.0 mm 42.0 mm +/- 1.0 mm 47.0 mm +/- 1.0 mm /
TTV <10µm <15µm <20µm <20µm <25µm <30µm
Bow <10µm <15µm <20µm <20µm <25µm <30µm
Warp <10µm <15µm <20µm <20µm <25µm <30µm
Surface Type Single Side Polished /Double Sides Polished
Polished side Epi-polished Ra<0.2nm(by AFM)
Back Side Criteria Fine ground, Ra= 0.8µm -1.2µm / Epi-polished Ra<0.2nm
Wafer Surface Criteria Contamination, None
Scratch , chipping None
Defect No edge cracks, scratches, saw marks, stains
Packaging Qty/Wafer box Class 100 cleanroom cleaning and vacuum packaging, 25 pieces in one cassette packaging or single piece packaging.

What to specify when you request a quote

  • Diameter and flat / notch — listed as “10mm-200mm”; state diameter, flat or notch and their tolerances.
  • Thickness and TTV — listed as “0.43mm-1.3mm”; give thickness, its tolerance and total thickness variation.
  • Polish and roughness — listed as “Ssp/DSP”; specify single- or double-side polish and roughness.
  • Flatness, bow and warp — listed as “<20um”; quote flatness, bow and warp limits.
  • Material grade — listed as “Moonocrystalline Al2o, High Purity”; name the grade (JGS1/JGS2, Borofloat 33, alkali-free, sapphire orientation).

Engineering guides for this part

For material grades and coating options, see Fused Quartz Wafer Substrate Selection: Materials & Coatings for Semiconductor and Optical Systems. How parts like this are machined and finished is covered in Precision Glass Hole Drilling & Micromachining for MEMS Wafers. For an application example, read Custom Perforated Quartz Plates for Appliance Airflow Sensors. Before sending a drawing, check Technical Guide to Glass Thickness and Flatness Requirements. A related standard product is 2× 100 mm JGS1 & JGS2 Quartz Glass Sheets.

FAQ

What is the Sapphire (Al2O3) Glass Wafer Substrate 2inch 0.50mm Thickness Ssp & DSP C-Plane made of? expand_more
It is listed as Moonocrystalline Al2o, High Purity. Other grades can be quoted if your application needs different transmission, thermal or chemical properties.
What sizes and thicknesses are available? expand_more
The listing gives diameter 10mm-200mm, thickness 0.43mm-1.3mm. Custom outlines and thicknesses are made to drawing; state the tolerance you need.
Where is this sapphire / specialty wafer used? expand_more
Listed applications: Glass.
What should I include in a quote request? expand_more
Include diameter and flat / notch, thickness and ttv, polish and roughness, flatness, bow and warp and material grade, plus quantity and a drawing if the part is custom.
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FREQUENTLY ASKED QUESTIONS
Which fused silica grade should I choose — JGS1, JGS2 or JGS3?

JGS1 offers deep-UV transmission from about 185 nm (best for DUV lithography and UV laser optics). JGS2 transmits well from about 220 nm for standard UV-visible use at lower cost. JGS3 is optimized for visible-to-infrared and high-power laser work. The builder exposes a transmission-band requirement so you can specify the grade by application.

What wafer diameters and thicknesses are supported?

Common diameters are 2, 3, 4 and 6 inch (note 1 inch = 25.0 mm for quartz wafers, so a 4 inch wafer is 100 mm). Typical thicknesses are 200, 500, 700 and 1000 µm, with tighter thickness tolerance and TTV specifiable for polished optical grades.

Can I specify TTV, surface quality and a flat or notch?

Yes. You can set total thickness variation, scratch-dig surface quality (down to 40/20 or 20/10 for optical grade), single- or double-side polish, and a primary flat or notch for orientation.

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Sapphire (Al2O3) Glass Wafer Substrate 2inch 0.50mm Thickness Ssp & DSP C-Plane

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