Product type: Intrinsic Semiconductor. Application: Semiconductor. Model: C-M 2.
Overview
The Stock Sapphire Substrates, Sapphire Wafers is supplied as a sapphire / specialty wafer made from Element Semiconductor. Listed for Semiconductor applications. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.
Specifications
| Material | Element Semiconductor |
|---|---|
| Type | Intrinsic Semiconductor |
| Application | Semiconductor |
| Batch Number | 2010+ |
| Model NO. | C-M 2 |
| Manufacturing Technology | Optical |
| stock products | sapphire substrates, sapphire wafers Cplane to M plane 2deg; |
| Crystal materials | 99, 996% of Al2O3, High Purity, Monocrystalline |
| Growth growth | KY |
| Related products | 1. 2inch, 3inch, 4inch & 6inch C plane sapphire substrates |
| Manufacture | Exhibition Show |
| Supplier | Jiaozuo Commercial Finewin Co., Ltd. |
Technical data
| Crystal materials | 99, 996% of Al2O3, High Purity, Monocrystalline |
|---|---|
| Crystal quality | Block marks, twins, Color, micro-bubbles and dispersal centers are non-existent |
| Diameter | 50.8±0.2mm 76.2±0.2mm 100.0±0.3mm 150.0±0.3mm |
| Thickness | 430±15 μ m, 500±15 μ m, 550±15 μm, 650±15 μm,1000±15 μm |
| Orientation | C-plane, M-plane, A-plane, R-plane, C-plane off M-plane, C-plane off A-plane |
| Primary flat Orientation | A-plane (1 1-2 0) ± 0.2° |
| Primary flat length | 16.0±1.5 mm, 32.50±1.5 mm, |
| TTV | ≤ 10 μm |
| LTV | ≤ 10 μm |
| BOW | ≤ 10 μm |
| Warp | ≤ 10 μm |
| Front Surface Back Surface | Epi-polished, Ra< 0.2nm (By AFM) Fine ground (Ra=0.5 to 1.2 μ M) or Epi-polished (Ra< 0.2 nm) |
| Cleaning/packaging | Class 100 clean room cleaning, vacuum packaging; 25 pieces in one cassette packaging or individual packaging. |
What to specify when you request a quote
- Diameter and flat / notch — state diameter, flat or notch and their tolerances.
- Thickness and TTV — give thickness, its tolerance and total thickness variation.
- Polish and roughness — specify single- or double-side polish and roughness.
- Flatness, bow and warp — quote flatness, bow and warp limits.
- Material grade — listed as “Element Semiconductor”; name the grade (JGS1/JGS2, Borofloat 33, alkali-free, sapphire orientation).
Engineering guides for this part
For material grades and coating options, see Fused Quartz Wafer Substrate Selection: Materials & Coatings for Semiconductor and Optical Systems. How parts like this are machined and finished is covered in Precision Glass Hole Drilling & Micromachining for MEMS Wafers.


