Product type: Quartz Boat. Application: Rubber, Plastic, Chemical, Construction, Metallurgy, Ceramic, Casting, Glass, Semiconductor/Solar.
Overview
Unique Black Quartz Boat Wafer Carrier: a fused silica / quartz wafer. Temperature 1100 Degree. Listed for Rubber, Plastic, Chemical, Construction and Metallurgy applications. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.
Specifications
| Type | Quartz Boat |
|---|---|
| Application | Rubber, Plastic, Chemical, Construction, Metallurgy, Ceramic, Casting, Glass, Semiconductor/Solar |
| Density | 2.2g/cm3 |
| Melt Point | 1750 Degree |
| Working Temperature | 1100 Degree |
| Sio2 | 99.99% |
| Annealing Point | 1210 Degree |
| Max Temperature Can Reach in a Short Tim | 1450 Degree |
| Heat Conductivity (W/M.K,1000℃ ) | 2.28 |
| Softening Point(℃) | 1250 Degree |
| Custom-Made Creations | We craft various shapes and sizes tailored to customers' specifications. |
| Versatile Processing | We offer deep processing services including cutting, fire ending, bending, frosting, and more. |
| Embrace Customization | We accommodate varying lengths, diameters, thicknesses, or customer-designed drawings. |
| Tailored Customization | Delivering non-standard instruments with precision and professional customization. |
| One-to-One Precision | Precisely restore drawings to exact specifications. |
| Applications | Specifically engineered for use in high-precision diffusion and advanced coating processes, |
| Packaging Details | Ensuring Your Quartz Products Arrive in Perfect Condition |
| Inner Packing | Our quartz products are encased in specially designed protective packaging to safeguard them against any potential damage. |
| Outer Packing | Sturdy cartons or robust wooden boxes, complemented by shock-absorbing materials and bubble wrap, ensure flawless delivery. |
| Swift Delivery Time | Typically within 7-20 days |
| Supplier | JIANGSU HONGYANG QUARTZ PRODUCTS CO.,LTD. |
Technical data
| Compressive strength | >1100Mpa | Coefficient of thermal expansion | 5.5×10-7cm/cm. ºC |
| Bending Strength | 67Mpa | Melting temperature | 1750~1800ºC |
| Tensile Strength | 48.3Mpa | The temperature for a short time | 1500ºC |
| Poisson's Ratio | 0.14~0.17 | The temperature for a long time | 1200°ºC to 1300 ºC |
| Elastic Modulus | 71700Mpa | Resistivity | 7×107.2.cm |
| Shearing Modulus | 31000Mpa | Dielectric Strength | 250~400Kvicm |
| Moh's Hardness | 5.3~6.5(Moh's Scale) | Dielectric Constant | 3.7~3.9 |
| Deformation Point | 1650ºC | Dielectric absorption coefficient | <4×104 |
| Specific Heat(20~350°ºC) | 670J/kgºC | Dielectric loss coefficient | <1×104 |
| Thermai Conductivity | 1.4W/mºC | Typical Mechanical Property of Fused Quartz |
What to specify when you request a quote
- Diameter and flat / notch — state diameter, flat or notch and their tolerances.
- Thickness and TTV — give thickness, its tolerance and total thickness variation.
- Polish and roughness — specify single- or double-side polish and roughness.
- Flatness, bow and warp — quote flatness, bow and warp limits.
- Material grade — name the grade (JGS1/JGS2, Borofloat 33, alkali-free, sapphire orientation).
Engineering guides for this part
For material grades and coating options, see Fused Quartz Wafer Substrate Selection: Materials & Coatings for Semiconductor and Optical Systems. How parts like this are machined and finished is covered in Glass Wafer Bonding for Microfluidic and MEMS Applications: Process Overview. For an application example, read Fused Silica Glass Wafers for Precision Appliance Electronics. Before sending a drawing, check Quartz Glass Manufacturing: Controlling Thermal Conductivity in Fused Silica. A related standard product is Fused Silica Glass Wafers (2–12", JGS1/JGS2).
