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Fused Silica With Microchannels

Fused Silica With Microchannels: Fused Silica, CTE 0.55 x 10^-6 /K. No MOQ, prototypes in 5-10 days, DFM review with every RFQ.

Fused Silica With Microchannels

Fused Silica With Microchannels – Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um); width from 10 um etched, 100 um machined. No minimum order; DFM review included with every RFQ.

When a drawing calls out Fused Silica, three numbers matter before any machining starts: CTE of 0.55 x 10^-6 /K, service temperature to 1,100 C continuous, and a transmission window of 185 nm – 2.5 um. fused silica with microchannels here begin with those numbers and end with dimensional reports.

The numbers

Material Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR))
Thermal expansion (CTE) 0.55 x 10^-6 /K
Service temperature 1,100 C continuous
Transmission range 185 nm – 2.5 um
Density 2.20 g/cm3
Knoop hardness 500 kg/mm2
Refractive index 1.458 @ 587 nm
Stock thickness 0.10 – 50 mm
Maximum blank size 450 x 450 mm
Feature Microchannels
Capability width from 10 um etched, 100 um machined
RFQ inputs PDF/DXF/STEP drawing, quantity brackets, surface and edge spec

Getting the drawing right

Before sending the RFQ, check these against your drawing:

  • Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
  • Feature rule: isotropic etch widens channels ~2x depth – masks are compensated.
  • Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.

For the complete framework, see the tolerance design guide and the holes and edges design guide.

Capabilities and limits

One material, many routes: on Fused Silica we also quote laser cutting, double-side polishing, lapping, drilling, and multi-step drawings are the norm rather than the exception.

These features are produced by etching or laser cutting. Capability: width from 10 um etched, 100 um machined. Design rule worth copying onto the drawing: isotropic etch widens channels ~2x depth – masks are compensated.

Where these parts end up

fused silica with microchannels shows up across laser systems (windows, beam splitters, debris shields); laboratory instruments (cuvettes, sight glasses, stir-cell windows); optical sensors (sensor windows, filter caps, lens covers). Background reading on the underlying material science: RP Photonics: fused silica.

The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.

Engineers scoping this work usually also review fused silica material guide, wafer dicing process, glass hole micromachining.

Buyer questions, answered

Is there a minimum order for fused silica with microchannels?

No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.

How fast can prototypes ship?

Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.

What files do you need for a quote?

A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.

Do parts ship with inspection data?

Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.

Specifications on this page were last reviewed by our engineering team in September 2026.

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FREQUENTLY ASKED QUESTIONS
What channel features and materials can I specify?

Channel width and depth, ports and chambers, in materials such as Borofloat 33, fused silica or quartz, with thermal or anodic bonding for a sealed device.

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