2 Inch (50.8 mm) Borofloat 33 Wafers – Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); 50.8 mm format, TTV <5 um. No minimum order; DFM review included with every RFQ.
A wafer is a specification bundle, not just a disc. 2 inch (50.8 mm) borofloat 33 wafers here mean SCHOTT float production, wafer grade material with certified CTE of 3.25 x 10^-6 /K, TTV controlled per format, and edges profiled for handler compatibility.
The numbers
| Material | Borofloat 33 (SCHOTT float production, wafer grade) |
|---|---|
| Thermal expansion (CTE) | 3.25 x 10^-6 /K |
| Service temperature | 450 C continuous |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.23 g/cm3 |
| Knoop hardness | 480 kg/mm2 |
| Refractive index | 1.471 @ 587 nm |
| Stock thickness | 0.70 – 25.4 mm |
| Maximum blank size | 500 x 500 mm |
| Diameter / format | 50.8 mm |
| Thickness | 0.2 – 1.0 mm typical |
| TTV | <5 um |
| Flat / notch | SEMI or C-flat |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Design guidance
Three items decide most of the cost and lead time on this work:
- Material note: float tin side must be tracked when parts see coating or bonding steps.
- Specify flat or notch orientation relative to your device layout – regrinding orientation later scraps the wafer.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Manufacturing capability
One material, many routes: on Borofloat 33 we also quote lapping, etching, drilling, sandblasting, and multi-step drawings are the norm rather than the exception.
Typical applications
Orders for 2 inch (50.8 mm) borofloat 33 wafers cluster in machine vision (camera windows, ring-light diffusers, calibration plates); microfluidic devices (chips, manifolds, via plates, bonded stacks); led packaging (groove covers, phosphor carriers, package windows). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
Useful companion pages: Borofloat 33 selection guide, wafer dicing process, ultra-thin quartz discs.
Common questions
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Borofloat 33 parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Float tin side must be tracked when parts see coating or bonding steps.
What thickness range do you stock for Borofloat 33?
Standard stock spans 0.70 – 25.4 mm, with blanks up to 500 x 500 mm. Other formats are sourced per order.
How does Borofloat 33 behave under heat?
CTE is 3.25 x 10^-6 /K and continuous service reaches 450 C continuous, which is what drives its use where float-glass flatness off the line matters.
Is there a minimum order for 2 inch (50.8 mm) borofloat 33 wafers?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
Specifications on this page were last reviewed by our engineering team in October 2026.