2 Inch (50.8 mm) Borofloat 33 Wafers – Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); 50.8 mm format, TTV <5 um. No minimum order; DFM review included with every RFQ.
A wafer is a specification bundle, not just a disc. 2 inch (50.8 mm) borofloat 33 wafers here mean SCHOTT float production, wafer grade material with certified CTE of 3.25 x 10^-6 /K, TTV controlled per format, and edges profiled for handler compatibility.
The numbers
| Material | Borofloat 33 (SCHOTT float production, wafer grade) |
|---|---|
| Thermal expansion (CTE) | 3.25 x 10^-6 /K |
| Service temperature | 450 C continuous |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.23 g/cm3 |
| Knoop hardness | 480 kg/mm2 |
| Refractive index | 1.471 @ 587 nm |
| Stock thickness | 0.70 – 25.4 mm |
| Maximum blank size | 500 x 500 mm |
| Diameter / format | 50.8 mm |
| Thickness | 0.2 – 1.0 mm typical |
| TTV | <5 um |
| Flat / notch | SEMI or C-flat |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
DFM notes from the shop floor
The shop-floor rules that matter here:
- Material note: float tin side must be tracked when parts see coating or bonding steps.
- Specify flat or notch orientation relative to your device layout – regrinding orientation later scraps the wafer.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Capabilities and limits
One material, many routes: on Borofloat 33 we also quote coring, ultrasonic machining, edge grinding, lapping, and multi-step drawings are the norm rather than the exception.
Application context
2 inch (50.8 mm) borofloat 33 wafers shows up across led packaging (groove covers, phosphor carriers, package windows); optical sensors (sensor windows, filter caps, lens covers); microfluidic devices (chips, manifolds, via plates, bonded stacks). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
For adjacent specifications, see Borofloat 33 selection guide, 4 inch Borofloat wafers, thickness and flatness guide.
Common questions
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Borofloat 33 parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Float tin side must be tracked when parts see coating or bonding steps.
What thickness range do you stock for Borofloat 33?
Standard stock spans 0.70 – 25.4 mm, with blanks up to 500 x 500 mm. Other formats are sourced per order.
Specifications on this page were last reviewed by our engineering team in September 2026.