6 Inch (150 mm) Fused Silica Wafers – Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um); 150 mm format, TTV <3 um. No minimum order; DFM review included with every RFQ.
6 inch (150 mm) fused silica wafers are supplied as finished substrates: edge-rounded, cleaned and packed in wafer cassettes. The material brings near-zero thermal expansion and deep-UV transmission; the format brings SEMI-compatible handling.
Specification envelope
| Material | Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR)) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 50 mm |
| Maximum blank size | 450 x 450 mm |
| Diameter / format | 150 mm |
| Thickness | 0.5 – 1.1 mm |
| TTV | <3 um |
| Flat / notch | SEMI notch or flat |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Capabilities and limits
One material, many routes: on Fused Silica we also quote dicing, etching, cnc machining, double-side polishing, and multi-step drawings are the norm rather than the exception.
Getting the drawing right
The shop-floor rules that matter here:
- Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
- Specify flat or notch orientation relative to your device layout – regrinding orientation later scraps the wafer.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Application context
6 inch (150 mm) fused silica wafers shows up across medical diagnostics (flow cells, slides, microplate bottoms, cuvette windows); microfluidic devices (chips, manifolds, via plates, bonded stacks); mems devices (cap wafers, TGV substrates, motion-sensor lids). Background reading on the underlying material science: RP Photonics: fused silica.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
Useful companion pages: CNC machining capability, fused silica wafers 2-12 inch, ultra-thin quartz discs.
Common questions
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Fused Silica parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Its hardness and brittleness demand diamond tooling and controlled feeds.
What thickness range do you stock for Fused Silica?
Standard stock spans 0.10 – 50 mm, with blanks up to 450 x 450 mm. Other formats are sourced per order.
How does Fused Silica behave under heat?
CTE is 0.55 x 10^-6 /K and continuous service reaches 1,100 C continuous, which is what drives its use where near-zero thermal expansion matters.
Is there a minimum order for 6 inch (150 mm) fused silica wafers?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
Specifications on this page were last reviewed by our engineering team in October 2026.