Laser Cutting Quartz Glass Wafers – Quartz Glass (CTE 0.59 x 10^-6 /K, 260 nm – 2.5 um); Laser Cutting to +/-0.02 mm contour. No minimum order; DFM review included with every RFQ.
The combination of Quartz Glass and Laser Cutting comes up constantly in RFQs for a reason – the material offers plasma and halogen resistance, and Laser Cutting is the right way to get accurate geometry into it. Expect +/-0.02 mm contour and sealed edge, chip-free.
The numbers
| Material | Quartz Glass (GE214-equivalent, semiconductor grade) |
|---|---|
| Thermal expansion (CTE) | 0.59 x 10^-6 /K |
| Service temperature | 1,050 C continuous |
| Transmission range | 260 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.459 @ 587 nm |
| Stock thickness | 0.20 – 60 mm |
| Maximum blank size | 450 mm diameter |
| Process | Laser Cutting |
| Working tolerance | +/-0.02 mm contour |
| Minimum feature | 0.10 mm hole diameter |
| Surface finish | sealed edge, chip-free |
| Thickness window | 0.03 – 6 mm |
| Edge condition | filamentation edge, optional post-polish |
| Wafer formats | 2", 3", 4", 6", 8" and 12" with SEMI flats or notch |
| TTV | under 3 – 5 um by format |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Design guidance
Three items decide most of the cost and lead time on this work:
- Material note: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
- Process boundary: aspect ratio in a single pass tops out near 10:1; thicker sections shift to coring or ultrasonic work.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Process window
Laser Cutting earns its place through chip-free free-form contours and dense hole arrays in thin and ultra-thin glass. Its boundary condition – aspect ratio in a single pass tops out near 10:1; thicker sections shift to coring or ultrasonic work – is the first thing our DFM review checks.
Beyond this page, Quartz Glass routinely runs through etching, lapping, grinding, coring in our shop – most real parts combine two or three of these steps.
Who orders this
Orders for laser cutting quartz glass wafers cluster in semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); laboratory instruments (cuvettes, sight glasses, stir-cell windows). Background reading on the underlying material science: ScienceDirect: quartz glass.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Related reading on this site: glass in laser systems, beam splitter glass, holes and edges design guide.
Common questions
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Quartz Glass parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
Specifications on this page were last reviewed by our engineering team in October 2026.