6 Inch (150 mm) Borofloat 33 Wafers: Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); 150 mm format, TTV <3 um. Single-piece prototypes to production volumes, quoted from your drawing.
A wafer is a specification bundle, not just a disc. 6 inch (150 mm) borofloat 33 wafers here mean SCHOTT float production, wafer grade material with certified CTE of 3.25 x 10^-6 /K, TTV controlled per format, and edges profiled for handler compatibility.
The numbers
| Material | Borofloat 33 (SCHOTT float production, wafer grade) |
|---|---|
| Thermal expansion (CTE) | 3.25 x 10^-6 /K |
| Service temperature | 450 C continuous |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.23 g/cm3 |
| Knoop hardness | 480 kg/mm2 |
| Refractive index | 1.471 @ 587 nm |
| Stock thickness | 0.70 – 25.4 mm |
| Maximum blank size | 500 x 500 mm |
| Diameter / format | 150 mm |
| Thickness | 0.5 – 1.1 mm |
| TTV | <3 um |
| Flat / notch | SEMI notch or flat |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Design guidance
The shop-floor rules that matter here:
- Material note: float tin side must be tracked when parts see coating or bonding steps.
- Specify flat or notch orientation relative to your device layout – regrinding orientation later scraps the wafer.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
What the process holds
Beyond this page, Borofloat 33 routinely runs through polishing, grinding, sandblasting, dicing in our shop – most real parts combine two or three of these steps.
Application context
6 inch (150 mm) borofloat 33 wafers shows up across optical sensors (sensor windows, filter caps, lens covers); microfluidic devices (chips, manifolds, via plates, bonded stacks); mems devices (cap wafers, TGV substrates, motion-sensor lids). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Engineers scoping this work usually also review wafer dicing process, Borofloat 33 selection guide, edge grinding overview.
Buyer questions, answered
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Borofloat 33 parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Float tin side must be tracked when parts see coating or bonding steps.
What thickness range do you stock for Borofloat 33?
Standard stock spans 0.70 – 25.4 mm, with blanks up to 500 x 500 mm. Other formats are sourced per order.
Specifications on this page were last reviewed by our engineering team in September 2026.